Records 5,531
Page 276/461

Flex Power Modules Introduces SIP-7 DC/DC Converters for Gate Drive Power Applications
2022-03
Power
Flex Power Modules
[Mar 23 2022] Flex Power Modules has introduced the PUC-D2BG series of 2W DC/DC converters in an industry standard SIP-7 format package, through-hole. The family includes nominal 12V, 15V, and 24V input voltages, as well as optional dual, unregulated output voltages for asymmetric positive and negative gate drive voltages in a wide variety of semiconductor switches, including IGBT, GaN, silicon, and Silicon Ca ...

ADLINK Introduces Latest Computer-on-Modules Based on Intel Xeon D Processors
2022-03
Power
AnDAPT, Inc.
[Mar 23 2022] ADLINK, the world's leading edge computing solution provider, has launched the latest Intel® Xeon® D-based computer-on-module (COM), including COM-HPC server module and COM Express Type 7 module. ADLINK Computer-on-Modules are based on the Intel® Xeon® D-2700 and D-1700 series processors (codenamed Ice Lake-D) with integrated high-speed Ethernet, up to 8x 10G or more PCIe Gen4 lanes, and state-of ...

TDK Introduces Compact CeraLink Capacitors in EIA 2220 Size
2022-03
Power
TDK
[Mar 23 2022] The TDK Group has expanded its proven CeraLink® series capacitor portfolio to cover small sizes. Previously, the portfolio consisted only of large-size models ready to use. To expand its range of applications, we have introduced a small version with a classic chip design. The package size of the new series of components is as small as EIA 2220, which is only 5.7 x 5 x 1.4 mm. The models with orde ...

TDK Launches Two New High-Performance Ultrasonic ToF Sensors
2022-03
Semiconductors
TDK
[Mar 23 2022] TDK Group announces the Chirp ICU-10201 and ICU-20201, two new high-performance, ultra-low power, integrated ultrasonic time-of-flight sensor products for short- and long-range detection. The new MEMS sensor embeds a more powerful on-chip processor with more computing power, and its enhanced processing power allows a wide range of application algorithms to run directly through the chip, eliminati ...

Teledyne e2v is currently shipping its aerospace-grade DDR4 memory solutions
2022-03
Sensors
Teledyne LeCroy
[Mar 23 2022] Development of Teledyne e2v Semiconductor's ultra-high-density memory DDR4 continues, with news that aerospace-grade positives are now shipping to key customers around the world. This marks a major step forward for this pioneering project after the samples provided successfully led to a wide range of event designs and adoption of this technology. As such, the company is now entering mass producti ...

Diodes Introduces Small Form Factor 3.8V-32V Buck Converter to Support High Efficiency Automotive PoL Product Applications
2022-03
Power
Diodes Incorporated
[Mar 23 2022] Diodes Incorporated offers several automotive-qualified synchronous buck converters. The AP6320xQ and AP6330xQ devices are rated at 2A and 3A, respectively, and support a wide input voltage range from 3.8V to 32V. Ideal for automotive point-of-load (PoL) product applications, including powertrain, electronic instrument panels, telematics and infotainment systems, as well as enhancing the performa ...

PI launches InnoSwitch3-EP IC with 1700V withstand voltage with integrated silicon carbide switch
2022-03
Passive Components
Pi Supply
[Mar 22 2022] The versatile InnoSwitch3-EP switch IC product family welcomes a new batch of new members, these devices use silicon carbide (SiC) primary switching MOSFETs and integrated controllers. Suitable for industrial applications, these 1700V rated devices can replace discrete controller plus MOSFET designs, saving space, time and cost while improving reliability in applications such as new energy, indus ...

Winbond launches new ultra-low power 64Mb 1.2V SPI NOR Flash
2022-03
Sensors
Winbond Electronics
[Mar 22 2022] Winbond Electronics, a global leader in semiconductor storage solutions, announced today that it has launched a new SpiFlash® product, W25Q64NE, which expands the capacity of 1.2V SPI NOR Flash to 64Mb for the first time. Winbond's new W25Q64NE flash memory can provide more code storage space and reduce the operating power consumption of the device, fully meeting the memory requirements of the ne ...

Vishay Introduces New AEC-Q200 Qualified Hybrid Wirewound Charging Resistors
2022-03
Semiconductors
Vishay
[Mar 22 2022] Vishay Intertechnology, Inc. introduces AEC-Q200-qualified, industry-leading new charging resistor HRHA using hybrid winding technology and standard package size. The Vishay MCB HRHA operates up to +250 C and can be used as a pre-charge and discharge resistor for electric vehicle (EV), hybrid electric vehicle (HEV) and plug-in hybrid electric vehicle (PHEV) inverters and converters. Typically, de ...

Infineon introduces OptiMOSTM 5 25V and 30V power MOSFETs in PQFN 2x2 package
2022-03
Semiconductors
Infineon Technologies
[Mar 21 2022] Infineon Technologies AG has launched a new product family of OptiMOSTM 5 25 V and 30 V power MOSFETs in PQFN 2 x 2 mm2 packages, aiming to set a new industry standard for discrete power MOSFET technology. Using thin wafer technology and innovative packaging, these new devices offer significant performance advantages in extremely small dimensions. The OptiMOS 5 25 V and 30 V power MOSFET product ...

Ouster launches car-grade, fully customized digital lidar receiver chip
2022-03
Passive Components
Ohmite
[Mar 21 2022] High-resolution digital lidar supplier Ouster has released the latest Chronos chip, a vehicle-grade, fully customized digital lidar receiver chip that will be mounted on its DF series solid-state lidar. The Chronos chip is the foundation of the entire DF architecture, ensuring that Ouster can provide higher-performance, more efficient and more compact digital lidars for L2 to L5 automation in pro ...

Renesas Electronics Announces Next-Generation WPC Qi 1.3 Certified In-Vehicle Wireless Charging Reference Design
2022-03
Semiconductors
Renesas Electronics America
[Mar 21 2022] Renesas Electronics Group, a global supplier of semiconductor solutions, announced the release of the P9261-3C-CRBv2, a next-generation WPC Qi-certified customer reference design for in-vehicle wireless charging. The design meets industry needs and enables automakers to quickly and efficiently implement superior performance and safety features for in-cockpit wireless charging applications. The P9 ...