Technology Articles

2022-03 Power Recom Power

[Mar 28 2022] RECOM has added the RAC20E-K/277 series to the E-K series, which is a 20W AC/DC power supply module mounted on a PCB. Although it is an economical design, the package size is only 52.7 mm x 27.6 mm, which is the same as the existing 20W. Due to the different pinout, it is compatible with more industry standards. Full load operation is possible over an extremely wide input range of 85 – 305Vac. Th ...

2022-03 Sensors pSemi

[Mar 28 2022] pSemi Corporation, a Murata company focused on semiconductor integration technology, has introduced the industry's first single-pole, four-throw switch for high-frequency applications up to 67 GHz, further expanding the company's RF SOI product portfolio. The new switches are compact and energy efficient with best-in-class insertion loss, linearity, switching time and power handling in the FR2 fr ...

2022-03 Sensors MikroElektronika

[Mar 28 2022] In recent years, with the popularization of mobile terminals such as smartphones and tablet computers and the cloudification of information, the amount of data communication is rapidly increasing, and the mobile communication systems in countries around the world are shifting from the fourth generation to the fifth generation. Therefore, DFB lasers installed in optical communication equipment in ...

2022-03 Semiconductors Nexperia

[Mar 28 2022] Nexperia, the high-volume production specialist in basic semiconductor components, announces a new enhanced electrothermal model for MOSFET devices. Semiconductor manufacturers often provide simulation models for MOSFETs, but are generally limited to a small number of device parameters modeled at typical operating temperatures. Nexperia's new advanced models capture a complete range of device par ...

2022-03 Semiconductors TDK

[Mar 27 2022] TDK Corporation has expanded its product lineup with the introduction of a new chip varistor model AVRH10C101KT4R7YA8, which can be used in automotive Ethernet applications with strong anti-static discharge capability The new product utilizes high-precision lamination technology, optimizes the manufacturing process and process design, achieves a narrow tolerance of 4.7±0.57㎊ within the capacitanc ...

2022-03 Semiconductors ON Semiconductor

[Mar 27 2022] Leading the way in smart power and IntelliSense technology, ON Semiconductor has introduced the latest mixed-signal controller dedicated to bridgeless totem-pole power factor correction (TP PFC) topologies. The target application for the NCP1681 is ultra-high density offline power supplies. The new controller builds on the success of the NCP1680 for designs up to 350 W, extending power capability ...

2022-03 Semiconductors Qualcomm

[Mar 27 2022] Qualcomm Technologies has launched a new smart camera IoT solution - Qualcomm QCS7230, which expands the product portfolio of Qualcomm's visual intelligence platform and promotes the digital transformation of enterprise security prevention and public safety. Safeguard the environment. The new solution will bring superior edge AI inference, using real-time edge computing, artificial intelligence ( ...

2022-03 Optoelectronics Amprobe

[Mar 27 2022] Ampwall Semiconductor Technology Co., Ltd. has launched a new series of four-way output products. This family of products features the industry's highest current density, highest efficiency, fastest dynamic voltage scaling (DVS) and transient response performance, as well as extensive fault protection features. Like previous members of the Ampwall family of integrated DC/DC converters, the new di ...

2022-03 Sensors Advanced Energy

[Mar 27 2022] Advanced Energy Corporation of the United States has launched the Artesyn LCC1200 series of fanless, conduction cooling AC-DC power supplies. The LCC 1200 is the latest addition to Advanced Energy's LCC series, offering up to 1200W of power output and 93.5% efficiency in a compact form factor. These new power supplies are ideal for industrial applications including outdoor LED digital signage, tr ...

2022-03 Sensors Analog Devices

[Mar 26 2022] AMD announced the full launch of the world's first data center CPU with 3D chip stacking, the third-generation AMD EPYC processor with AMD 3D V-Cache technology, codenamed "Milan-X". Based on the "Zen 3" core architecture, these processors further expand the 3rd Gen EPYC processor family offering up to 66% more power for various target technology computing workloads compared to non-stacked 3rd Ge ...

2022-03 Sensors Amphenol Advanced Sensors

[Mar 26 2022] PEI-JET, the world's leading precision connector and cable assembler, announced the assembly of the Amphenol 62GB connector series in Asia. It is designed based on the US MIL-DTL-26482 specification and is suitable for harsh environments and heavy-duty industrial applications. High voltage, high power connectors. Product housings are available in reinforced brass and stainless steel. In addition, ...

2022-03 Semiconductors Infineon Technologies

[Mar 26 2022] Infineon Technologies AG announces the launch of a new EDT2 IGBT in the TO247PLUS package. The device is optimized for discrete automotive traction inverters, further enriching Infineon's product lineup of automotive-grade discrete high-voltage devices. Thanks to its outstanding quality, EDT2 IGBTs meet and exceed AECQ101, the automotive-grade semiconductor discrete device stress test standard, t ...