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Technology Articles

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TDK introduces the SMD varistor with high surge current capability

2024-02 Passive Components TDK
[Feb 4 2024] TDK Corporation has recently introduced two new series of SMD varistors. The new family of components have a wide operating voltage range of 175 VRMS to 460 VRMS (corresponding to DC voltages of 225 VDC to 615 VDC). The B72210M* series is equivalent to the S14 lead type sheet varistor with A surge impulse current capability of 6000 A, while the B72214M* series is equivalent to the S20 lead type s ...
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Qorvo introduces D2PAK packaged SiC FETs to enhance 750V electric vehicle design performance

2024-02 Power Qorvo US Inc.
[Feb 4 2024] Qorvo announces an automotive compliant Silicon Carbide (SiC) field-effect transistor (FET) product; Industry-leading 9mΩ on-resistance RDS(on) in the compact D2PAK-7L package. The 750V SiC FETs, the first product in Qorvo's new pin-compatible SiC FETs, offer a current resistance of up to 60mΩ and are ideal for electric vehicle (EV) applications such as on-board chargers, DC/DC converters and pos ...
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Wurth Elektronik presents a very compact and cost-effective MEMS digital humidity sensor

2024-02 Sensors Wurth Electronics
[Feb 3 2024] Wurth Elektronik presents a very compact and cost-effective MEMS digital humidity sensor in the WSEN-HIDS series, available in a DFN package size of just 1.5mm x 1.5mm x 0.5mm for SMT assembly. The MEMS humidity sensor has a measurement accuracy of ±1.8% RH in the relative humidity range of 20% to 80%. With an operating current of just 0.4 µA and an operating power supply voltage of 1.08 to 3.6V, ...
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Infineon XENSIV Stray field Robust linear TMR sensor

2024-02 Sensors Infineon Technologies
[Feb 3 2024] Infineon Technologies combines its proven expertise in magnetic position sensor technology with proven linear tunnel magnetoresistance (TMR) technology to introduce the XENSIV TLI5590-A6W magnetic position sensor. The sensor is available in a wafer-scale package for linear and angular incremental position detection. This semiconductor device complies with the JEDEC JESD47K standard and is suitabl ...
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P-DUKE Boda Power introduces highly integrated DC/DC prestage filters for defense and rail

2024-02 Connectors PIC GmbH
[Feb 2 2024] P-DUKE has developed the MCF series of MIL-COTS DC/DC pre-stage filters to meet MIL-STD 1275E (28V DC electrical systems for military vehicles) and MIL-STD 461 (Electromagnetic Interference Control for equipment and subsystems). These filters accept 9-36Vdc input voltages and are suitable for military vehicles, aircraft with 28V or 24V systems, as well as for heavy industry and rolling stock appl ...
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AOS introduces 95mohm and 125mohm, 600V fast recovery diode aMOS5™ superjunction MOSFETs

2024-02 Passive Components Amgis
[Feb 2 2024] AOS, a leading supplier of power semiconductors and chips that integrates design, development, production and global sales, has launched two aMOS5™ 600V FRD overjunction MOSFETs. aMOS5™ is AOS's market and application proven high voltage MOSFET platform designed to meet the high efficiency and high density needs of servers, workstations, telecom rectiters, solar inverters, electric vehicle chargi ...
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Infineon introduces a new generation of ZVS flyback converter chipsets

2024-02 Power Infineon Technologies
[Feb 1 2024] With the increasing popularity of USB-C power transfer (PD) charging technology, the demand for compatible chargers is also increasing throughout the consumer market. Today, users demand adapters that are powerful yet compact in design. The secondary side-controlled ZVS flyback converter chipset EZ-PD PAG2 from Infineon Technologies AG meets this need. The chipset consists of two different models ...
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U-blox introduces new functional safety end-to-end positioning solutions

2024-02 Power Unictron Technologies Corporation
[Feb 1 2024] U-blox announced the launch of u-safe, a comprehensive vehicle location function safety solution, to drive the pace of mass production of autonomous vehicles. u-safe leverages the well-developed components of automotive driver navigation systems to provide Tier 1 suppliers and Oems with advanced Automatic Driver Assistance System (ADAS) positioning solutions that support this segment with outstan ...
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Microchip announces the PIC16F13145 family of MCUS, promoting new developments in customizable logic

2024-01 Connectors Microchip Technology
[Jan 31 2024] To meet the growing demand for customization in embedded applications, Microchip Technology introduced the PIC16F13145 series of microcontrollers (MCUS) to provide tailor-made hardware solutions. This family of MCUS is equipped with a new kernel-independent peripheral (CIP) that allows you to configure logic block modules to create custom hardware-based combined logic functions directly within th ...
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Renesas introduces a new four-channel video decoder to help in-car cameras achieve economical circumnavigation applications

2024-01 Connectors Renesas Electronics America
[Jan 31 2024] Renesas Electronics announced the introduction of the RAA279974, the latest device in its in-Vehicle HD Link (AHL) portfolio, which enables automakers to transmit high-definition video over low-cost cables and connectors. The new RAA279974 quad-channel AHL video decoder can handle four input sources simultaneously, making it an economical solution for circumnavigation and multi-camera application ...
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Vishay introduces a new fully integrated ultra-compact proximity sensor with standby current as low as 5μA

2024-01 Passive Components Vishay
[Jan 30 2024] Vishay Intertechnology announced that its optoelectronics division has introduced a new fully integrated proximity sensor, the VCNL36828P, to improve efficiency and performance in consumer electronics applications. Vishay Semiconductors VCNL36828P uses vertical cavity surface emitting laser (VCSEL), Integrated photodiode, application-specific integrated circuit (ASIC), 16-bit ADC and intelligent ...
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Honeywell and NXP Semiconductors are working together to promote smart energy management in buildings

2024-01 Power Honeywell Aerospace
[Jan 30 2024] Honeywell and NXP Semiconductors announced a Memorandum of Understanding (MOU) at the International Consumer Electronics Show (CES 2024) to collaborate on optimizing how commercial buildings sense and control energy consumption safely. According to the International Energy Agency (IEA), building operations account for 30% of global final energy consumption and 26% of global energy-related emissio ...