ADLINK Introduces Latest Computer-on-Modules Based on Intel Xeon D Processors

     ADLINK, the world's leading edge computing solution provider, has launched the latest Intel® Xeon® D-based computer-on-module (COM), including COM-HPC server module and COM Express Type 7 module. ADLINK Computer-on-Modules are based on the Intel® Xeon® D-2700 and D-1700 series processors (codenamed Ice Lake-D) with integrated high-speed Ethernet, up to 8x 10G or more PCIe Gen4 lanes, and state-of-the-art AI acceleration , while providing a wider operating temperature range for embedded and rugged applications.

● ADLINK's two computer-on-modules are powered by Intel® Xeon® D processors (formerly Ice Lake-D), featuring industrial-grade reliability and a wider operating temperature range for embedded and rugged applications.

oCOM-HPC-sIDH Server Module: Xeon D-2700 series, contains up to 20 CPU cores, 30MB cache, 512GB DDR4 memory, power consumption from 65 to 118 watts

oExpress-ID7 Type 7 module: Xeon® D-1700 series, power envelope up to 67W TDP while providing up to 10 CPU cores and 128GB DDR4 memory

●Integrated high-speed Ethernet up to 8x 10G, or other configurations combined with up to 32 PCIe Gen4 lanes for instant responsiveness and efficient performance.

● Equipped with Intel® TCC, Deep Learning Acceleration Technology (VNNI), AVX-512 for optimal accelerated AI performance, and support for Time Sensitive Networking (TSN) to provide precise control for hard real-time workloads on all connected devices.

     Junjie Wang, Senior Product Manager of ADLINK's Module Product Center, said, "ADLINK's new computer-on-module integrated high-speed Ethernet greatly reduces the complexity and time requirements in the design and development process. With industrial-grade reliability, and a wider working temperature range, these modules are particularly suitable for mission-critical edge applications.”

     ADLINK COM-HPC-sIDH is a D-size COM-HPC server module with Intel® Xeon® D-2700 HCC processor, up to 20 CPU cores, 30MB cache, 512GB DDR4 memory capacity , 8x 10G or 4x 25G Ethernet with power consumption from 65 to 118 watts. In addition, ADLINK Express-ID7 is a COM Express Type 7 module based on Intel® Xeon® D-1700 LCC processor, which can provide up to 67W TDP power envelope, with up to 10 CPU cores, 128GB DDR4 memory capacity and 4x 10G Ethernet.

     ADLINK Computer-on-Modules are based on Intel® Ice Lake-D, and ADLINK COM can be used for AI inference processing with the help of Intel® Deep Learning Acceleration Technology (VNNI) and Intel® AVX-512, which can well meet on-device machine learning and The demands of deep learning pipelines surpass previous generations in machine vision, natural language processing, and intelligent video analytics. In addition, the new ADLINK Computer-on-Modules feature Intel® Timing Coordination Computing (Intel® TCC) and provide Time Sensitive Networking (TSN) support for precise CPU core control and timely synchronization of networked devices while ensuring low latency , Deterministic performance to drive hard real-time workloads.

     ADLINK COM-HPC-sIDH also provides Module Management Controller (MMC) with IPMB interface and a dedicated PCI-BMC channel. Combined with the operator's Baseboard Management Controller (BMC), it provides users with convenient remote management functions such as Serial Local Area Network (SOL) and iKVM.

     ADLINK’s new Computer-on-Modules are designed for edge and rugged AI applications, enabling system integrators to realize all IoT innovations—from edge networking, drones, autonomous driving, robotic surgery, to rugged HPC Servers, 5G base stations, automatic drilling, ship management, etc.

     ADLINK also offers COM-HPC and COM Express server starter kits based on COM-HPC-sIDH and COM-ID7 modules, where COM-HPC Server Base provides AI accelerator support via Gen4 PCIe (2 x 16), 10GbE fiber/copper Cable Ethernet expansion and provides local and remote IPMI/BMC management via VGA, COM and dedicated Ethernet.