Teledyne e2v is currently shipping its aerospace-grade DDR4 memory solutions

     Development of Teledyne e2v Semiconductor's ultra-high-density memory DDR4 continues, with news that aerospace-grade positives are now shipping to key customers around the world. This marks a major step forward for this pioneering project after the samples provided successfully led to a wide range of event designs and adoption of this technology. As such, the company is now entering mass production, offering space-grade radiation-hardened DDR4.

     The Teledyne e2v's DDR4s storage capacity is 4Gbytes and measures only 15mm x 20mm x 1.92mm, which is much higher in storage density than competing solutions - occupying only half the PCB real estate and reducing the volume by almost an order of magnitude. They have high performance and can provide 2.4GT/s data transfer speed. Each Teledyne e2v DDR4T04G72 memory is available in a multi-chip package (MCP) with extended bus capability, with 64 bits for data transfer and 8 bits for error correction. The DDR4T04G72 is the best companion to the company's own Qormino® processors and is compatible with the vast majority of processors, SOCs and FPGAs from other vendors.

     Radiation testing of these DDR4s showed that their single-event lock-on (SEL) thresholds were greater than 60MeV.cm²/mg. Their single-event upset (SEU) and single-event functional disruption (SEFI) data also exceed 60 MeV.cm²/mg, and they have demonstrated recovery to 100 krad total ion irradiation (TID).

     Teledyne e2v's DDR4 can be ordered for the industrial temperature range (-40°C to 105°C) or the military temperature range (-55°C to 125°C), and can reach NASA Grade 1 (based on NASA EEE -INST-002 - Section M4 - PEMs), which means a wider range of potential applications can be met.

     "We are regarded as the leader in high-density radiation-tolerant memory for space applications, and our technology has been incredibly well-received in the market. What sets us apart from our competitors is that we provide comprehensive, open data package, providing customers with everything they need to start and complete their designs in the shortest possible time, with all background information and expert engineering support readily available” said Thomas Guillemain, Marketing and Business Development Manager at Teledyne e2v: “We provide aerospace Industry offers reliable, compact, easy-to-connect memory that raises the performance benchmark. We have made great strides on the roadmap for the next phase, with other generations and higher capacity devices currently in the pipeline.”