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Microchip supports certified Qi 1.3 wireless charging
2022-03
Semiconductors
Microchip Technology
[Mar 31 2022] To ensure high quality wireless charging power transmitters, the Wireless Power Consortium (WPC) has published the Qi 1.3 specification with extended power profiles. The new specification creates a need for a full-service, high-security chip authentication device. In response to this demand, Microchip Technology Inc. announced the new industrial-grade TrustFLEX ECC608 and automotive-grade Trust A ...

Intel Unveils World's Best-Performing 12th Gen Core i9-12900KS
2022-03
Sensors
Intel
[Mar 31 2022] Intel introduces the new 12th Gen Intel Core i9-12900KS processor with Intel Thermal Velocity Boost Technology and Intel Adaptive Boost Technology (Intel ABT) up to 5.5 GHz for an exceptional gaming experience 1. "Intel continues to push the limits of desktop gaming performance with the new 12th Gen Intel Core i9-12900KS processor, which features Intel's 12th Gen High Performance Hybrid architect ...

Analog Devices mmWave 5G Chipset Supports Full 5G NR FR2 Spectrum
2022-03
Sensors
Analog Devices
[Mar 31 2022] Analog Devices, Inc. has introduced a millimeter-wave (mmW) 5G front-end chipset capable of addressing the required frequency bands, enabling designers to reduce complexity and bring smaller, general-purpose radios to market faster. Consisting of four highly integrated ICs, the chipset provides a complete solution that greatly reduces the number of components required for 24GHz to 47GHz 5G radio ...

Sierra Space Revolutionizes Space Exploration with Siemens Xcelerator
2022-03
Power
Siretta Ltd
[Mar 31 2022] Siemens Digital Industries Software announced that Sierra Space, the world's leading commercial aerospace company, has deployed the Siemens Xcelerator solution portfolio to lay the foundation for its next-generation digital engineering program. Sierra Space is committed to building and delivering commercial space transportation and infrastructure for Low Earth Orbit (LEO), and by deploying its Xc ...

ROHM establishes mass production system for 150V GaN HEMT with gate withstand voltage up to 8V
2022-03
Semiconductors
Rohm Semiconductor
[Mar 30 2022] ROHM, a world-renowned semiconductor manufacturer, has established a mass production system for 150V withstand voltage GaN HEMT*1 "GNE10xxTB series (GNE1040TB)". The gate withstand voltage (gate-source rated voltage)*2 of this series of products is up to 8V, It is very suitable for power supply circuits of industrial equipment such as base stations and data centers and various Internet of Things ...

Infineon launches new generation of EiceDRIVER 2EDN gate driver chip family
2022-03
Semiconductors
Infineon Technologies
[Mar 30 2022] Infineon Technologies AG has introduced a new generation of the EiceDRIVER™ 2EDN gate driver chip family. The new devices complement the existing line of 2EDN driver chips, reducing the number of external components and saving design space, resulting in higher system efficiency, superior power density and continued system robustness. With the introduction of new products, 2EDN series driver chips ...

STMicroelectronics Releases Economical Radiation Hardened Chips
2022-03
Semiconductors
STMicroelectronics
[Mar 30 2022] STMicroelectronics, the world's leading semiconductor company serving multiple electronic applications, simplifies the design and mass production of a new generation of small low-earth orbits (LEO) satellites. Affordable and reliable low-orbit (LEO) satellites can provide services such as Earth observation and broadband internet from low-Earth orbit. ST's new family of radiation-hardened power, a ...

Swissbit launches FIDO2 validator
2022-03
Power
Swissbit
[Mar 30 2022] Swissbit has added a whole new product category to its portfolio of security solutions. As experts in industrial storage and security products, iShield FIDO2 is Swissbit's first authenticator for the FIDO2 open authentication standard. When logging in with iShield FIDO2, it provides extremely strong security for accessing web services and online accounts through asymmetric encryption and hardware ...

FSP releases the first PC power supplies that meet the new standards of ATX 3.0 and PCIe 5.0
2022-03
Sensors
EPC
[Mar 29 2022] FSP Group, one of the leading manufacturers of high-performance power supplies, has released the first new products that comply with the Intel PSDG ATX 3.0 and PCIe 5.0 specifications. In recent years, with the soaring performance and power consumption of mid-to-high-end graphics cards, the traditional 3 sets of 8-pin connectors have become increasingly overwhelmed. And for the slow-to-update pow ...

ST Adds a Space-Saving, Low Offset 20MHz High-Performance 5V Op Amp Family
2022-03
Semiconductors
STMicroelectronics
[Mar 29 2022] The STMicroelectronics TSV772 dual operational amplifier (op amp) combines high precision with low power consumption and is available in a small 2.0mm x 2.0mm DFN8 package. TSV772 belongs to STMicroelectronics high-performance 5V op amp series, with rail-to-rail input and rail-to-rail output, gain bandwidth product (GBW) 20MHz, unity gain stability, slew rate 13V/µs, input noise density 7nV/√Hz, ...

Vishay Introduces New Automotive Grade High Voltage Thin Film Flat Chip Resistors
2022-03
Semiconductors
Infineon Technologies
[Mar 29 2022] Vishay Intertechnology, Inc. announced that it has expanded its TNPV e3 series of automotive-grade high-voltage thin-film flat chip resistors with the introduction of the 0805 small form factor device. The Vishay Draloric TNPV0805 e3 is the industry's most advanced 0805 form factor small device, operating up to 450 V, with tolerances as low as 0.1 %, and a TCR of only 10 ppm/K. Small size and hig ...

Yamaichi Electric and JAE Jointly Develop 112Gbps Jumper Cable Interconnect Products for Next-Generation Data Networking Market
2022-03
Power
ZF Electronics
[Mar 28 2022] Yamaichi Electric Co., Ltd. and Japan Aviation Electronics Industry Co., Ltd. jointly developed a prototype of a high-speed jumper cable interconnect product that supports 112Gbps PAM4 signaling over data network systems. With the popularization of 5G networks and the development of technologies other than 5G/6G, the market has higher and higher requirements for data transmission speed and perfor ...