
TDK Group announces the Chirp ICU-10201 and ICU-20201, two new high-performance, ultra-low power, integrated ultrasonic time-of-flight sensor products for short- and long-range detection. The new MEMS sensor embeds a more powerful on-chip processor with more computing power, and its enhanced processing power allows a wide range of application algorithms to run directly through the chip, eliminating the need to add additional load to the system MCU.
The ICU-10201 and ICU-20201 are high performance ultrasonic time-of-flight (ToF) sensors that integrate a PMUT (piezoelectric micromachined ultrasonic transducer) and an ultra-low power SoC in a tiny 3.5 x 3.5 mm2 reflowable package. MEMS sensors provide accurate distance measurements up to 5m across a wide and configurable field of view (FoV) on any surface and lighting conditions.
Due to the powerful embedded processor and expanded memory space, the sensor has stronger computing power and can directly complete the application algorithm through the chip. Compared with the previous generation products, ICU-10201 and ICU-20201 have added the following: Function: Has 10x speed DSP and hardware multiplier to achieve more computing power. 3x larger code storage space. 2x larger data memory. A fast host interface (SPI) and support for a wide range of IO supply voltages.
"With the introduction of the ICU-10201 and ICU-20201, TDK continues to expand the SmartSonic™ product line, which enhances the performance of everyday products and makes them greener and more efficient," said Massimo Mascoto, Director of Product Marketing, Chirp, a TDK Group company. Safer and more aware of the surrounding environment. In order to adapt to the dramatic changes brought about by the recent Covid-19 pandemic, sensors need to implement contactless control of appliances in public areas such as factories, schools, train stations and airports to improve personal safety.”
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