Technology Articles

2021-08 Semiconductors NXP

[Aug 20 2021] NXP Semiconductors announced the launch of the RapidRF family of reference boards for 5G radio. Designed for large-scale MIMO systems, the RapidRF is compact in size and integrates linear pre-drivers, RF power amplifiers, Rx Lnas with T/R switches, circulators, and bias controllers. The RapidRF solution integrates all RF front-end functions in a single turnkey board design that supports NXP's sec ...

2021-08 Semiconductors Dialog Semiconductor GmbH

[Aug 20 2021] Dialog Semiconductor, a leading provider of battery and power management, Wi-Fi, Bluetooth Low Energy (BLE), and industrial edge computing solutions, announced the introduction of an innovative digital Zero Voltage Switch (ZVS) chipset that enables high power density (HPD) power supplies (Psus) of 100W and above. The size is 30% to 50% smaller than a traditional high-power PSU. Historically, AC/D ...

2021-08 Power STMicroelectronics

[Aug 19 2021] Arrival has designated STMicroelectronics as one of its key partners for the industrialization of connected electric vehicles. As part of the overall mobility ecosystem, ST's leading technologies will be used to deliver future-proof zero-emission commercial vehicles to Arrival's customers. Arrival selected ST's high-performance safety vehicle gauge microcontroller to develop a modular ECU platfor ...

2021-08 Sensors Teledyne LeCroy

[Aug 19 2021] Teledyne e2v, part of Teledyne Imaging Group, Teledyne Technologies, Inc. announced Tetra, a low-cost, high-performance four-wire CMOS sensor family. Tetra sensors are ideal for food sorting, recycling, logistics, pick and place, document scanning, and other machine vision applications where monochrome, color, and multispectral imaging require high cost effectiveness. The Tetra sensor is availabl ...

2021-08 Sensors ams

[Aug 18 2021] Today, robots, cobots, and autonomous guided vehicles are becoming more advanced and capable of performing more tasks than in the past. Technological progress in the field of 3D sensor technology is an important force to promote the rapid development of this trend, especially in the field of infrared light sources, which play an important role. Ams OSram's latest Belago 1.1 lattice projection mod ...

2021-08 Sensors OmniVision Technologies Inc

[Aug 18 2021] OmniVision Technologies has announced the next generation of OH08A and OH08B CMOS image sensors - the first 8-megapixel resolution sensors for disposable and reusable endoscopes. In addition, the new OH08B is the first medical-grade image sensor to feature Howe's award-winning Nyxel near-infrared technology, bringing disruptive imaging capabilities beyond the visible spectrum to the healthcare in ...

2021-08 Sensors Maxim Integrated

[Aug 17 2021] Maxim Integrated has announced the launch of a new generation of infrared based dynamic gesture detection optical sensors capable of detecting various gestures at longer distances. Compared to previous products, the MAX25405 can detect a larger range of motion, and the detection range is doubled to 40cm; One-quarter the size and 10 times less expensive than camera-based time-of-flight (ToF) detec ...

2021-08 Connectors Infineon Technologies

[Aug 17 2021] Infineon Technologies introduces the 1200 V 15 A Integrated Power Module (IPM) in a rotating mold package. The CIPOS™ Maxi IPM IM818-LCC is a new addition to the existing IM818 family that integrates an optimized 6-channel 1200V SOI gate driver and six TRECHSTOP™ IGBTs to improve system reliability and optimize PCB size and system cost. The IM818-LCC breaks new ground on the power density level, ...

2021-08 Optoelectronics DLP Design Inc.

[Aug 16 2021] DELO curing lamps are modular in design and can be optimally adjusted to specific customer needs. DELO, a leading supplier of equipment and process solutions for the semiconductor industry, has designed the DELOLUX 203 UV surface light curing lamp for cleanroom environments. The new curing lamp is based on the acclaimed DELOLUX 20 and uses water cooling instead of air cooling. There is no univers ...

2021-08 Passive Components Nexperia

[Aug 16 2021] Nexperia has announced the world's smallest and thinnest 14, 16, 20 and 24-pin packages for standard logic devices. For example, the 16-pin DHXQFN package is 45% smaller than the industry-standard DQFN16 pin-free device. The new package not only has a smaller pin size than competing products, but also saves 25% of the PCB area. With package sizes of only 2 mm x 2 mm (14 pins), 2 mm x 2.4 mm (16 p ...

2021-08 Sensors Texas Instruments

[Aug 15 2021] Texas Instruments has introduced a new line of advanced humidity sensors that not only offer industry-leading reliability and accuracy and ultra-low power consumption, but also provide built-in protection through inductive components. With the HDC3020 and HDC3020-Q1, engineers will be able to create more reliable industrial and automotive systems that can withstand potential damage from moisture ...

2021-08 Power Qualcomm

[Aug 15 2021] Qualcomm Technologies has announced enhancements to its 5G RAN platform portfolio with the launch today of the 5G DU X100 accelerator card, which is built in a way that enables infrastructure providers and operators to take advantage of energy-efficient 5G, low latency and high performance, while facilitating the adaptation of the cellular ecosystem to a virtualized Radio Access Network (RAN). Th ...