Records 5,531
Page 293/461

BYD Semiconductor launches "four-in-one" MCU with high integration and low power consumption, supporting touch buttons, RFID detection, etc.
2022-01
Power
Broadcom
[Jan 19 2022] According to BYD Semiconductor's official account, following the launch of China's first integrated touch and RFID smart lock master MCU (BF5823AM48) in August 2020, BYD Semiconductor has recently integrated product advantages and multi-dimensional upgrades. High-configuration, higher-positioned "four-in-one" MCU - BF5885AM64. According to reports, the "four-in-one" MCU chip can integrate and rea ...

Infineon launches EiceDRIVER 1EDN71x6G HS 200V single-channel gate driver IC family
2022-01
Sensors
Infineon Technologies
[Jan 19 2022] Minimizing investment in R&D and cost, as well as ensuring robust and efficient operation of medium-voltage gallium nitride (GaN) switches, are several core requirements for modern power electronic system design. Infineon Technologies continues to strengthen full system solutions in line with its strategically engineered GaN product portfolio with the launch of the EiceDRIVER™ 1EDN71x6G HS 200V s ...

Infineon launches a new generation of AURIX™ MCUs with a main frequency of 500MHz
2022-01
Semiconductors
Infineon Technologies
[Jan 18 2022] Important trends for future mobility are carbon neutrality, autonomous driving, connectivity and information security. And microelectronics will play a central role in the transformation of mobility. As a leader in the global automotive semiconductor market, Infineon Technologies AG continues to lead the future of mobility with technological innovation. The company today announced the launch of t ...

TDK is the first in the industry to recycle PET film for multilayer ceramic chip capacitors (MLCCs)
2022-01
Semiconductors
TDK
[Jan 18 2022] ●This TDK system can successfully reuse PET film that is usually only heat recovered or incinerated directly in the MLCC manufacturing process ●In practical application, the utilization rate of recycled PET film is increased to 20% Generally, the surface of waste PET film produced during MLCC manufacturing is specially treated and cannot be reused without any further treatment. Therefore, the mai ...

TT Electronics Introduces HPDC Series High Power Density Chip Resistors
2022-01
Power
TT Electronics
[Jan 17 2022] TT Electronics Corporation, a global supplier of engineering technologies for performance-critical applications, has announced the launch of its HPDC series of high power density chip resistors. This specialized design is optimized for power management, actuator drive, and heating applications that benefit from enhanced component-to-terminal heat transfer. Using such high power density components ...

Toshiba's new IC chip achieves another success, which can greatly improve the battery life of wearable devices and IoT devices
2022-01
Semiconductors
Toshiba Semiconductor and Storage
[Jan 17 2022] Toshiba Electronic Devices & Storage Corporation ("Toshiba") today announced the launch of the TCK12xBG series of load switch ICs that support extremely low quiescent current[1] and a rated output current of 1A. Housed in a compact WCSP4G package, this family of ICs enables product developers to design innovative next-generation wearables and IoT devices with lower power consumption and longer ba ...

Toshiba Expands Lineup of Ethernet Bridge ICs for Automotive Information Communication Systems and Industrial Equipment Applications
2022-01
Semiconductors
Toshiba Semiconductor and Storage
[Jan 16 2022] Toshiba Electronic Devices & Storage Corporation announced that it has launched a new product line of Ethernet bridge ICs, "TC9563XBG", designed to support 10Gbps communication in automotive telematics systems and industrial equipment. Sample shipments of the product are now underway and mass production will begin in August 2022. In-vehicle networks are moving towards a regional architecture [1], ...

Allegro Introduces Industry's Smallest Sin/Cos 3D Position Sensor
2022-01
Connectors
Allegro MicroSystems, LLC
[Jan 16 2022] Allegro MicroSystems, a global leader in sensing technology and power semiconductor solutions for motion control and energy-saving systems, announces the new A33230 Sin/Cos 3D Hall-Effect Position Sensor IC, the smallest Sin/Cos 3D sensor on the market today. Provides cost-effective solutions and faster time-to-market for system designers in areas such as automotive and industrial. The A33230 con ...

XP Power Introduces New 60W Slim AC-DC Power Supplies for a Variety of Cost-Sensitive Applications
2022-01
Power
XP Power
[Jan 15 2022] XP Power introduces a new 60W ultra-thin AC-DC power supply for a variety of cost-sensitive applications including information technology equipment, industrial electronics, household, Internet of Things (IoT) and robotics. In order to further penetrate the market and expand sales, manufacturers in cost-sensitive applications are constantly looking for high-quality, easy-to-use power solutions at ...

FSP launches 2400W power supply to solve the bottleneck problem of high-energy computing
2022-01
Passive Components
Flexipanel
[Jan 15 2022] ● Low iTHD ● Working temperature: 0 to 50 degrees Celsius ● Can operate in areas above 5000 meters above sea level ● Support OCP, OTP, OVP circuit protection ● All outputs are short-circuit protected ● Resettable power switch ● Mean time between failures: 100,000 hours of continuous operation at 25 degrees Celsius and 100% output load ● Small size of 185 mm ● 80PLUS Platinum certification, high p ...

Immervision Releases World's Thinnest Notebook Camera Module
2022-01
Connectors
Illinois Capacitor
[Jan 14 2022] Immervision, the world's leading developer of advanced vision systems, has announced its new 8-megapixel wide-angle camera module for notebook and tablet PCs. It is reported that Immervision's patented technology brings edge-to-edge image clarity, and the 8-megapixel ultra-wide-angle lens and sensor combination is only 3.8mm thick, which provides a variety of applications requiring higher resolut ...

ROHM Releases Evaluation Board for Ultra-Efficient Battery Management Solution for Small and Thin IoT Devices
2022-01
Semiconductors
Rohm Semiconductor
[Jan 14 2022] The world-renowned semiconductor manufacturer ROHM (headquartered in Kyoto, Japan) has developed an ultra-efficient battery management solution (suitable for various wearable devices, electronic shelf labels, smart cards, etc.) that can be easily evaluated for the growing IoT field. IoT device) evaluation board "REFLVBMS001-EVK-001" In recent years, battery-powered electronics have become ubiquit ...