TT Electronics Introduces HPDC Series High Power Density Chip Resistors

     TT Electronics Corporation, a global supplier of engineering technologies for performance-critical applications, has announced the launch of its HPDC series of high power density chip resistors. This specialized design is optimized for power management, actuator drive, and heating applications that benefit from enhanced component-to-terminal heat transfer. Using such high power density components reduces PCB board area and improves reliability by suppressing temperature rise in component hot spots.

     “Aluminum Nitride (with its large area solder terminations) offers the highest power density to date for TT Electronics’ HPDC family of products. With this product, our customers can reduce the size of their power conversion designs while at the same time Improves component reliability by suppressing component hot spot temperatures," said Brian Stephenson, director of engineering at TT Electronics. "These features make the HPDC family ideal for high transient load conditions such as power supplies, motor drives, power amplifiers and actuator controls."

     TT Electronics' new HPDC series of chip resistors use an aluminum nitride (AlN) ceramic substrate that has approximately six times the thermal conductivity of aluminum oxide, the traditional substrate material for chip resistors. HPDC chip resistors also feature large-area solder terminations for better thermal contact with the PCB board. Therefore, the heat generated in the resistive element is efficiently carried away, thereby reducing the temperature rise. This enables HPDC resistors to provide high power density solutions, with 1206 resistors rated at 2.4W and 2512 resistors rated at 3.5W. Short-term overload performance is also improved, with 1206 and 2512 resistors boosting power to 4.7W and 7.7W, respectively, for 5 seconds, making HPDC products ideal for active capacitive bleeder circuits. Additionally, these high power resistors can be used in temperature controlled heating applications where the input power is limited only by the 155°C maximum component temperature and 110°C termination maximum temperature.