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C&K follows the RK series with the RKC2 touch switch
2021-09
Power
C&K
[Sep 25 2021] C&K announced the launch of the RKC2 series of tap switches following the RK series to meet more market demands. The RKC2 is a small switch ideal for applications where height is a major constraint and is available in four different operating forces (180gf, 250gf, 350gf and 500gf). The RKC2 switch was developed for small electronic devices such as car keys, iot devices, wearables, mobile phones, ...

Bourns launches a new series of extended push-pull transformer product line PAD00x-T764
2021-09
Connectors
Bourns
[Sep 25 2021] Bourns, a leading manufacturer and supplier of electronic components, now introduces its PAD00x-T764 isolation transformer series. With functional isolation and a low form factor of 0.4 mm, these transformers simplify isolated power supply and serial communication signal integrity in CAN, RS-485, RS-422, RS-232, SPI, I2C and LAN-based low-power applications. The PAD00x-T763 series is ideal for in ...

EPC introduces a 40 V, 1.6 mΩ gallium nitride field-effect transistor
2021-09
Passive Components
ECS
[Sep 25 2021] EPC has introduced a 40 V, 1.6 mΩ gallium nitride field-effect transistor (eGaN FET) with the device model EPC2069 designed for designers, and EPC2069 is smaller, more efficient and more reliable than the available devices on the market today for high-performance, space-constrained applications.EPC is a global leader in enhanced silicon-based gallium nitride power transistors and integrated circu ...

Arduino Pro has teamed up with Bosch Sensortec to launch Nicla Sense ME
2021-09
Sensors
Bosch Sensortec
[Sep 24 2021] The strong collaboration between Arduino PRO and Bosch Sensortec sets a new benchmark for smart sensing solutions: Nicla Sense ME is the smallest Arduino Pro product to date that also uses the latest generation of Bosch sensor technology for edge sensing and edge intelligence. Equipped with a 9DoF smart motion sensor and an AI-enabled 4DoF environment sensor, the co-developed appboard enables a r ...

Amphenol develops high-speed IP interconnect technology
2021-09
Connectors
Amphenol LTW
[Sep 24 2021] Amphenol ICC, a global leader in connector Technology, design and manufacturing, and eTopus Technology, a pioneer of ADC/ DSP-based ultra-high speed SerDes for wire applications such as data centers, cloud, edge and 5G base stations, announced the development of 112Gb/s interconnect technology based on their respective products. This combined solution is suitable for, but not limited to, high-spe ...

TDK introduces a new generation of ultra-low noise MEMS pressure sensors
2021-09
Sensors
TDK
[Sep 24 2021] TDK Corporation has announced the worldwide launch of the InvenSense ICP-20100 platform, a new generation of versatile air pressure sensors ideal for use in smartphones, tablets, drones and smart home appliances. Through architectural innovation, ICP-20100 improves the accuracy and temperature stability of the SmartPressure™ family of products, improves long-term drift, and elevates the industry ...

Vishay introduces a new series of AEC-Q200 certified high power thin film surround patch resistors
2021-09
Passive Components
Vishay
[Sep 24 2021] Vishay Intertechnology introduces a new series of AEC-Q200 certified high power thin film surround patch resistors, the PHPA series. The Vishay Dale Film PHPA series resistors are available in 1206 and 2512 dimensions, with power ratings of 1.0 W and 2.5 W respectively, and use self-passivating tantalum nitride resistance film technology with excellent moisture resistance. In addition to industri ...

The Infineon PSoC 64 standard secure MCU family is PSA Level 2 certified for the Arm platform
2021-09
Connectors
Infineon Technologies
[Sep 24 2021] Infineon Technologies has announced that the company's PSoC 64 microcontroller (MCU) standard Security family of devices has achieved Arm Platform Security Architecture (PSA) Level 2 certification. Level 2 certification includes a laboratory evaluation of the PSA Trust Root (PSA-ROT) to demonstrate that the device is protected from extensible software attacks. The evaluation lab performs vulnerab ...

TDK has expanded its CN series laminated ceramic chip capacitors product lineup
2021-09
Passive Components
TDK
[Sep 23 2021] TDK Corporation has expanded its CN series Laminated Ceramic Chip capacitors (MLCC) product lineup, the first of its kind. The new 3216 size product (3.2 x 1.6 x 1.6 ㎜) has a capacitance of 10 μF and 3225 size (3.2 x 2.5 x 2.5 ㎜) has a capacitance of 22 ㎌, providing a low resistance resin electrode with low-end sub-resistance comparable to the standard product. MLCC with resin electrode prevents ...

Qorvo launches two BAW filters to support global 5G base station deployments
2021-09
Connectors
Qorvo US Inc.
[Sep 23 2021] Qorvo, a leading provider of RF solutions for mobile, infrastructure and aerospace and defense applications, has introduced two bulk acoustic wave (BAW) filters to support ongoing global 5G base station deployments. Compared to similar products, the new QPQ3500 and QPQ3501 filters offer OEM pin-compatible base stations, 5G filter solutions with lower insertion losses, and excellent out-of-band re ...

Silicon Designs single-axis Model 2210 series accelerometers are available for industrial vibration testing
2021-09
Connectors
Silicon Motion, Inc.
[Sep 23 2021] Silicon Designs is a global industry specialist in the design, development and manufacture of commercial-grade MEMS capacitive accelerometer chips and modules with inertial products that meet zero-to-medium frequency test and instrumentation requirements. Recently, Silicon Designs announced that its single-axis Model 2210 series products are immediately available. Silicon Designs' low-noise, low- ...

Silicon Mitus designs highly efficient switched capacitive charge pumps for fast charge applications
2021-09
Passive Components
Silicon Motion, Inc.
[Sep 23 2021] Silicon Mitus has announced the SM5450, a switched capacitor fast-charge pump. The SM5450's DC-DC converters are highly optimized to meet the needs of emerging fast charging applications in the mobile market, providing higher conversion efficiency, shorter battery charge times, and better management of heat dissipation during the device's charge cycle. It is a fast charge chip specifically custom ...