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Stray Field Robust 3D HAL Position Sensors with Integrated Decoupling Capacitors Now Available from TDK
2022-06
Semiconductors
TDK
[Jun 17 2022] TDK Corporation has expanded its Micronas 3D HAL sensor portfolio with the Hall sensor series HAC 39xy* with integrated capacitors for stray field robust position detection in automotive and industrial applications. The TO92UF package is designed for PCB-free applications and combines a HAL 39xy series chip with stray field compensation and up to two capacitors up to 330 nF. The new sensors are s ...

Renesas Electronics Releases Industry's First 60W Wireless Power Receiver IC
2022-06
Semiconductors
Renesas Electronics America
[Jun 17 2022] Renesas Electronics Group, a global semiconductor solutions provider, has launched the world's first 60W wireless power receiver, the P9418, to create a faster wireless charging experience for smartphones, laptops and notebook devices with an industry-leading power density solution. The highly integrated P9418 wireless power receiver uses Renesas' exclusive WattShareTM technology to deliver up to ...

ON Semiconductor LED Driver Solutions Add Intelligence to Connected Lighting
2022-06
Semiconductors
ON Semiconductor
[Jun 17 2022] ON Semiconductor, driving energy-efficient innovations, has introduced two new devices that enhance the performance of connected lighting systems, the NCL31000 and NCL31001 LED drivers, enabling manufacturers to develop LED luminaires with light-based positioning technology and visible light communication. Adding data intelligence and accurate positioning (up to 30 cm), these solutions will revol ...

From "mobile" to "automotive", Samsung expands automotive memory lineup
2022-06
Power
Samsung
[Jun 17 2022] Samsung has launched a series of high-end automotive memory solutions designed for next-generation autonomous electric vehicle applications. The new product lineup includes 256GB PCIe Gen3 NVMe ball grid array (BGA) packaged SSDs for high-performance in-vehicle infotainment systems, 2GB GDDR6 and 2GB DDR4 DRAM products, and 2GB GDDR6 DRAM and 128GB UFS ( General Purpose Flash) products. Jinman Ha ...

Infineon introduces new gate driver ICs for 5G and LTE macro base stations
2022-06
Semiconductors
Infineon Technologies
[Jun 17 2022] Infineon Technologies AG has launched the new EiceDRIVER 2EDL8 gate driver IC product family to meet the growing demand for mobile network infrastructure DC-DC telecom bricks. These dual-channel junction isolated gate driver ICs provide high power density, high efficiency and ruggedness for isolated DC-DC buck converters/telecom bricks enabling macro base stations for 5G and LTE telecom infrastru ...

Vicor Introduces First Radiated Fault Tolerant DC-DC Converter Power Module
2022-06
Optoelectronics
Vicor
[Jun 17 2022] Vicor Corporation announces its first radiation fault tolerant DC-DC converter power module in Vicor's newest electroplated SM-ChiP package. The ChiP can power low-voltage ASICs up to 300 watts from a nominal 100V supply, and has been tested by Boeing to not only be resistant to a total ionizing dose of 50 krad, but also resistant to single-event upsets. Immunity to single-event upsets is achieve ...

3.5ms ultra-high-speed write, EEPROM
2022-06
Semiconductors
Rohm Semiconductor
[Jun 17 2022] ROHM has developed a data recording system that can store and write data stably even in harsh environments, and supports I2C Bus*1 and EEPROM "BR24H-5AC series" operating at 125°C. In the field of in-vehicle and industrial equipment, system operation data needs to be recorded in non-volatile memory*2 in the system due to safety and traceability management requirements. Among them, compared with n ...

TI's new high-precision battery monitors and balancers improve performance of wired and wireless battery management systems
2022-06
Semiconductors
Texas Instruments
[Jun 17 2022] Texas Instruments (TI) has introduced a new automotive battery monitor and balancer that accurately reports voltage measurements in systems up to 800 V. Additionally, the BQ79616-Q1 simplifies compliance procedures for Safety Integrity Level ASIL D for hybrid electric (HEV) and electric vehicles (EV). A major design challenge for automakers is how to filter system-level noise to accurately measur ...

TI Introduces New 3D Hall Effect Position Sensor, Combining High Speed and High Accuracy for Faster Real-Time Control
2022-06
Semiconductors
Texas Instruments
[Jun 16 2022] Texas Instruments introduces TI's accurate 3D Hall-effect position sensor. With the TMAG5170, engineers can achieve ultra-high accuracy without calibration at speeds up to 20 kSPS, enabling faster and more precise real-time control in factory automation and motor drive applications. The sensor also offers integrated functional and diagnostic features to maximize design flexibility and system safe ...

Vishay Introduces New Radial Fixed IHVR Inductors to Improve DC/DC Converter Energy Efficiency
2022-06
Semiconductors
TDK
[Jun 16 2022] Vishay Intertechnology, Inc. announces the introduction of a new IHVR radially fixed inductor, the IHVR-4025JZ-3Z, in a 10.25 mm x 6.4 mm x 10 mm 4025 form factor. The Vishay Dale IHVR-4025JZ-3Z features a new design that optimizes inductance, reduces DC internal resistance (DCR), improves DC/DC converter efficiency, operates up to +155 C, and is suitable for computer, server, communications, and ...

Vishay Introduces Small Signal Schottky and Switching Diodes in Ultra-Small Packages
2022-06
Power
Vishay
[Jun 16 2022] Vishay Intertechnology, Inc. announces the introduction of new surface mount small signal diodes, the 40 V BAS40L Schottky diode and the 100 V BAS16L, in an ultra-small wettable flank DFN1006-2A plastic package. These diodes save space, improve thermal performance, and are suitable for automotive and industrial applications. Both diodes are available in AEC-Q101 qualified versions. The diodes ann ...

Samsung 14nm EUV DDR5 DRAM officially mass-produced
2022-06
Power
Samsung
[Jun 16 2022] Samsung announced that it has started mass production of 14 nanometer (nm) DRAM based on extreme ultraviolet (EUV) technology. Following the launch of the first EUV DRAM by Samsung in March last year, the number of EUV layers has been increased to 5 layers, providing its DDR5 solution with a more high-quality and advanced DRAM process. "Samsung has been active in the global DRAM market for nearly ...