Stray Field Robust 3D HAL Position Sensors with Integrated Decoupling Capacitors Now Available from TDK

     TDK Corporation has expanded its Micronas 3D HAL sensor portfolio with the Hall sensor series HAC 39xy* with integrated capacitors for stray field robust position detection in automotive and industrial applications. The TO92UF package is designed for PCB-free applications and combines a HAL 39xy series chip with stray field compensation and up to two capacitors up to 330 nF. The new sensors are suitable for a variety of applications including valve and actuator, shifter, driveline or brake travel position detection. The PSI5 interface meets the latest requirements for chassis position detection sensors.

     The HAC 39xy sensor enables angular measurements up to 360° using ferrite bipolar magnets and linear measurements up to 35 mm using bipolar bar magnets. Since its additional 3D measurement outputs two independent angles, both types of stray-field-resistant position detection can be accommodated. The SENT interface transmits data from two angles, while the sensor has high ESD immunity and meets all stringent EMC requirements.

     At the heart of the HAC 39xy sensor is the patented 3D HAL pixel cell technology, which is insensitive to stray fields and accurately measures magnetic fields. The unique concept of the masterHAL® sensor family is derived from the Hall plate array. The highly flexible sensor array allows design engineers to select the best operating mode for any given measurement task.

     The HAC 39xy has a flexible architecture that enables a variety of configurations. It has an embedded microcontroller configured with a powerful DSP executable interface for fast signal processing, which supervises the execution of functional safety-related tasks. Thanks to the innovative architecture of the HAC 39xy sensor, customers can easily develop new solutions using rapid prototyping techniques. It also adapts quickly and easily to various interface standards such as SENT and PSI5.

     The pins of the TO92UF package can be soldered directly to the lead frame without the need for a PCB board, thus reducing the size and cost of the entire system. In addition, the long-term reliability of the entire system is significantly improved.