
Vicor Corporation announces its first radiation fault tolerant DC-DC converter power module in Vicor's newest electroplated SM-ChiP package. The ChiP can power low-voltage ASICs up to 300 watts from a nominal 100V supply, and has been tested by Boeing to not only be resistant to a total ionizing dose of 50 krad, but also resistant to single-event upsets. Immunity to single-event upsets is achieved by virtue of the redundant architecture. Two identical power modules with fault-tolerant control ICs are connected in parallel and packaged in high-density SM-ChiP modules to achieve anti-jamming function.
The complete solution from power to point of load consists of four SM-ChiPs: a BCM3423 (100V nominal, 300W K = 1/3 bus converter in a 34 x 23 mm package), a PRM2919 (33V nominal 200W regulator in a 29 x 19 mm package) and two VTM2919 current doublers (one at K = 1/32 at 150A, 0.8V output; one at K = 1/8 at 25A, The output voltage is 3.4V). The solution powers the ASIC directly from a 100V supply, uses minimal external components, and supports low noise operation.
Advanced communications satellites require high power density and low noise. Vicor's soft-switching high-frequency ZCS/ZVS power stages in metal-cased ChiP packages reduce power system noise floor, enabling signal integrity and highly reliable overall system performance.
All modules are packaged in Vicor high density SM-ChiP packages with BGA (Ball Grid Array) connections and optional solder mask for upper and lower surfaces. The operating temperature of ChiP is -30 ~ 125°C.
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