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TI Introduces New 3D Hall Effect Position Sensor
2022-06
Semiconductors
Texas Instruments
[Jun 1 2022] Texas Instruments introduces TI's accurate 3D Hall-effect position sensor. With the TMAG5170, engineers can achieve ultra-high accuracy without calibration at speeds up to 20 kSPS, enabling faster and more precise real-time control in factory automation and motor drive applications. The sensor also offers integrated functional and diagnostic features to maximize design flexibility and system safe ...

Molex's New RF mmWave 5G25 Connector Family Helps Mobile Device Manufacturers Create Better Designs
2022-06
Optoelectronics
Molex
[Jun 1 2022] Molex, a global electronics industry leader and connectivity innovator, has introduced the Flex-to-Board RF mmWave 5G25 connector series to meet the stringent signal integrity requirements of 5G mmWave applications for higher frequencies up to 25 GHz. Using this newest Molex micro connector, RF antenna component manufacturers and mobile device design engineers can optimize high-speed 5G component ...

Renesas Electronics Introduces New RA MCU Portfolio in Ultra-Small Packages, Enabling Ultra-Low Power Consumption and Innovative Peripheral Functions
2022-06
Power
Renesas Electronics America
[Jun 1 2022] Renesas Electronics Group, a global supplier of semiconductor solutions, announced the launch of a new product group, the RA2E2, for its 32-bit RA microcontroller (MCU) product family. Based on the Arm Cortex-M23 core, this series of products has low power consumption and peripherals suitable for IoT terminal applications. The package includes an ultra-small 16-pin WLCSP (Wafer Level Chip Scale P ...

Microchip Announces High-Precision Voltage Reference ICs with Extremely Low Drift for Automotive Applications Over a Wider Operating Temperature Range
2022-05
Semiconductors
Microchip Technology
[May 31 2022] Voltage reference ICs for automotive and industrial applications over a wider operating temperature range require low drift, high reliability and high performance. Microchip Technology Inc. announces a high-accuracy voltage reference (Vref) IC that addresses these needs at a cost-effective price. The new MCP1502 is an AEC-Q100 Grade 1 (-40 °C to +125 °C ambient operating temperature range) automo ...

Apacer launches AS2280P4U and AS2280P4U Pro M.2 NVMe SSDs
2022-05
Semiconductors
Apacer Memory America
[May 31 2022] Apacer has released two M.2 NVMe SSD products for the gaming market. The AS2280P4U and AS2280P4U Pro SSDs have a read and write speed of 3500/3000MB/s, and the latter also has an aluminum heatsink, which can reduce the operating temperature by 25% and maintain a stable performance state. Both AS2280P4U and AS2280P4U Pro use PCIe Gen3 X4 interface and 3D NAND technology, they conform to the NVMe 1 ...

STMicroelectronics 70W High-Power Wireless Charging Chipset Improves Charging Speed, Energy Efficiency and Flexibility
2022-05
Semiconductors
STMicroelectronics
[May 31 2022] STMicroelectronics' STWLC98 highly integrated wireless charging receiver chip brings faster wireless charging and flexible power sharing to a wide range of portable and mobile devices for home, office, industrial, healthcare and in-vehicle applications. When used in conjunction with the STWBC2-HP transmitter chip, the complete wireless charging transceiver system can provide up to 70W of power ou ...

STMicroelectronics Releases Highly Integrated Smart High-Side Driver for Automotive
2022-05
Semiconductors
STMicroelectronics
[May 31 2022] STMicroelectronics has launched a new generation of automotive intelligent switch modules VN9D30Q100F and VN9D5D20FN, which are the first driver chips on the market that add a digital current detection loop to the on-chip full digital diagnostic function, specially designed for high-side connections in 12V battery-powered automotive systems. Simplifies electronic control unit (ECU) hardware and s ...

STMicroelectronics launches ST4SIM M2M-compatible eSIM chip for mass market
2022-05
Semiconductors
STMicroelectronics
[May 31 2022] STMicroelectronics launches ST4SIM, a mass-market machine-to-machine (M2M) embedded SIM (eSIM) chip. Industrial eSIM chips provide all the services IoT devices need to connect to cellular networks, making them ideal for machine condition monitoring and predictive maintenance, as well as devices such as asset tracking, energy management, and connected healthcare. Additionally, these eSIM chips all ...

Flex Introduces PKU4116HD Series 1/16 Brick DC/DC Converters for RFPA and PoE Applications
2022-05
Power
Flex Power Modules
[May 31 2022] Flex Power Modules announces the PKU4116HD DC/DC Converter with Through-Hole Mounting Holes, featuring 36 to 60V input (80V peak) and fully regulated 55V output in an open frame module in an industry standard 1/16th brick package (33.02mm x 22.86mm x 9.8mm), the rated output power is 110W/2A, the maximum allowable ambient temperature for full-load output under natural convection is 50°C, and unde ...

Harwin Introduces Compact, High Pin Count 0.8mm Pitch Mezzanine Connectors for High Density Industrial Systems
2022-05
Sensors
Harwin Inc.
[May 30 2022] Continuing to expand its product portfolio for the industrial market, Harwin is now announcing the Archer .8 series, a dual row 0.8mm pitch board-to-board connector series with a stacking height of 5mm for applications where space is limited and price/performance is important , which includes applications such as factory automation and environmental monitoring equipment, smart meters, retail equi ...

TI's Integrated Transformer Module Technology Helps Further Increase Hybrid and Electric Vehicle Drive Times
2022-05
Power
Texas Instruments
[May 30 2022] Texas Instruments (TI) has introduced a smaller, more accurate 1.5W isolated DC/DC bias power module UCC14240-Q1. Using proprietary integrated transformer technology, the UCC14240-Q1 helps designers reduce the size of power solutions in half for use in high-voltage environments such as electric vehicles, hybrid vehicles, motor drive systems, and grid-tied inverters. As the EV market booms, automo ...

Renesas Electronics Introduces High-Precision, Cost-Effective Pressure Sensing Solutions for Automotive Electronics Applications
2022-05
Semiconductors
Renesas Electronics America
[May 30 2022] Renesas Electronics Group announced the launch of the RAA2S425x product family of ICs for automotive pressure sensing systems. The new RAA2S425x product family provides high-precision amplification and sensor-specific correction for automotive xEV/EV/FCEV pressure-sensing braking, transmission, and HVAC (heating, ventilation, and air conditioning) system signals. The RAA2S425x product family has ...