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Diodes company's ultra-high power density charger overall solution, with higher efficiency, more space-saving product advantages
2022-06
Optoelectronics
Diodes Incorporated
[Jun 4 2022] Diodes Incorporated has introduced a three-chip solution that enhances the performance of ultra-high power density USB Type-C power delivery (PD) systems. The solution products can be applied to a variety of consumer electronic product applications such as smart phone chargers and notebook computer transformers. The AP43771V USB Type-C PD decoder is compatible with multiple communication protocol ...

Vishay Introduces New Modular Panel Potentiometer with Industry-High 8 Ncm Torque
2022-06
Power
Vishay
[Jun 4 2022] Vishay Intertechnology, Inc Announces New Modular Panel Potentiometer - P11H with Industry-High 8 Ncm Torque - 200% Higher than the Next Competitor - Suitable for Off-Road, Aerospace and Industrial application. The Vishay Sfernice P11H can be configured with up to seven modules in a small form factor 12.5 mm package with a shaft diameter of 6.35 mm. The high-torque devices released today maintain ...

Vishay introduces new small 1500 form factor automotive-grade IHTH plug-in inductors with 156 A saturation current
2022-06
Semiconductors
Vishay
[Jun 3 2022] Vishay Intertechnology, Inc. announced the launch of two new automotive-grade IHTH high current, high temperature plug-in inductors in a small 1500 form factor - the IHTH-1500MZ-5A and IHTH-1500TZ-5A. These two inductors are suitable for automotive applications, Vishay Dale IHTH-1500MZ-5A (0.47 µH~4.7 µH) saturation current up to 156 A, very low typical DCR value of only 0.19 mW, IHTH-1500TZ-5A ( ...

TDK Develops Industry's Highest Current Rated Inductor for Automotive Power Over Coax (PoC) Systems
2022-06
Semiconductors
TDK
[Jun 3 2022] TDK Corporation has developed the ADL3225VM inductor for automotive PoC systems. The dimensions of the inductor are 3.2 ㎜ (length) × 2.5 ㎜ (width) × 2.5 ㎜ (height), and to accommodate expanding automotive and advanced driver assistance system (ADAS) applications, manufacturers have added more sensors and cameras, the inductor provides a compact solution for designers looking to reduce vehicle wei ...

ams and Osram join hands with Cadiz to lead the new frontier in the field of smart locks
2022-06
Sensors
ams
[Jun 3 2022] Ams Osram (SIX: AMS), the world's leading optical solutions leader, and Cadiz, the world's leading supplier of smart locks, have jointly launched the latest smart electronic lock, which uses ams Osram's TMF8801 sensor, which can input distance information into the face Ministry identification system. With the rapid development of smart locks and the introduction of the market, smart locks have be ...

PCI Express 3.0 Packet Switcher from Diodes Incorporated Offers Design Flexibility and Advanced Power Management
2022-06
Optoelectronics
Diodes Incorporated
[Jun 3 2022] Diodes Corporation announces the PI7C9X3G816GP, a PCIe 3.0 packet switch with flexible 2-, 3-, 4-, 5- and 8-port configurations supporting 16-channel operation. The switch is designed to meet the demands of advanced performance, especially for networking and telecom infrastructure, security systems, failover systems, artificial intelligence and deep learning, NAS, HBA cards, and data center produ ...

Infineon introduces the XENSIV TLE4972, a high-precision coreless current sensor for automotive applications
2022-06
Semiconductors
Infineon Technologies
[Jun 3 2022] Infineon Technologies AG presents the first automotive current sensor, the new XENSIV TLE4972. This coreless current sensor uses Infineon's proven Hall technology for accurate and stable current measurement. With its compact design and diagnostic modes, the TLE4972 is ideal for xEV applications such as traction inverters for hybrid and battery-powered vehicles, as well as battery main switches. B ...

ams Osram launches new VCSEL 3D gesture recognition product, bringing AR/VR interaction experience to the next level
2022-06
Power
ams
[Jun 2 2022] Osram, the world's leading optical solutions provider, has expanded its 3D sensing product portfolio with a new VCSEL (Vertical Cavity Surface Emitting Laser) module, the Bidos P2433 Q. Thanks to components such as the Bidos P2433 Q from ams Osram, various gestures can be more reliably and accurately captured, so applications based on 3D sensing technology will greatly benefit, such as machine vi ...

Microchip Introduces Family of Capacitive Touch Screen Controllers for Home Appliance Market
2022-06
Semiconductors
Microchip Technology
[Jun 2 2022] Connected home appliances allow both users and manufacturers to communicate with them over the Internet. For example, users of kitchen ovens can find new recipes online, and manufacturers can implement remote diagnostics or over-the-air firmware updates. Displays and touch sensors are critical to enabling this functionality in modern appliances. Microchip Technology Inc. announced that two new me ...

ST's robust isolated SiC gate driver saves space in a narrow SO-8 package
2022-06
Semiconductors
STMicroelectronics
[Jun 2 2022] ST's STGAP2SiCSN is a single-channel gate driver optimized for controlling SiC MOSFETs, featuring robust performance and precise PWM control in a space-saving narrow-body SO-8 package. SiC power technology is widely used to improve power conversion efficiency, and the SiC driver STGAP2SiCSN can simplify the design of energy-efficient power systems, drive and control circuits, save space, and enha ...

Vishay Introduces Molded Packaged High Voltage Chip Resistor Dividers to Reduce Component Count and Improve TC Tracking Performance
2022-06
Semiconductors
Vishay
[Jun 2 2022] Vishay Intertechnology, Inc. announces the launch of the industry's leading high voltage chip resistor divider, CDMM, in a standard surface mount molded package. Vishay Techno CDMM resistance divider with 4527 dimensions and maximum operating voltage up to 1500 V, reduces the number of components, improves TC tracking performance and proportional stability, suitable for automotive and industrial ...

Renesas Electronics Announces Development of Next-Generation Wireless MCUs Supporting Bluetooth Low Energy 5.3
2022-06
Semiconductors
Renesas Electronics America
[Jun 2 2022] Renesas Electronics Group, a global supplier of semiconductor solutions, announced that it will develop a new microcontroller (MCU) to support the recently released Bluetooth Low Energy (LE) 5.3 specification. The new product will be an important part of the Renesas Advance (RA) 32-bit Arm Cortex-M microcontroller product family, joining the RA4W1 Bluetooth 5.0 LE lineup introduced last year The ...