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Technology Articles

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Allegro introduces a new custom SOIC16W package called

2020-08 Sensors Allegro MicroSystems, LLC
[Aug 1 2020] Manchester, N.H. - Allegro MicroSystems, a global leader in power and sensing solutions for motion control and energy saving systems, announced the launch of a new custom SOIC16W package called "MC." This marks a leap forward for industry current sensing technology in power-intensive applications that require high isolation and low power consumption. The new package features an ultra-low series r ...
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STMicroelectronics introduces synchronous rectifier DC/DC converters for smart industrial applications

2020-07 Semiconductors STMicroelectronics
[Jul 28 2020] STMicroelectronics introduces the L6983 38V/3A synchronous rectifier DC/DC converter, which can maintain high energy efficiency at any load, up to 95% energy efficiency, and on-chip integrated synchronous rectifier MOSFET transistors can save external components and simplify the design process. The L6983 converter has an extremely low static current of only 17µA and is available in low current (L ...
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Texas Instruments introduces IC for EMI Optimized integrated transformer technology

2020-07 Semiconductors Texas Instruments
[Jul 27 2020] Texas Instruments has introduced the first integrated circuit (IC) developed with a new proprietary integrated transformer technology: the UCC12050, a 500mW highly efficient isolated DC/DC converter with the industry's lowest electromagnetic interference (EMI). Its height of 2.65mm enables designers to reduce the size of the solution (80% compared to discrete solutions and 60% compared to power m ...
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Qorvo launches a complete V2X front-end solution

2020-07 Power Qorvo US Inc.
[Jul 26 2020] Qorvo, a leading provider of RF solutions for mobile, infrastructure and aerospace and defense applications, introduces the first 47-band /Wi-Fi bulk acoustic wave (BAW) coexistence filter and a V2X front-end product suite based on it. Vehicle-to-everything (V2X) links can be enabled in remote communication units (TCU) and antennas while ensuring reliability. With 286 million connected passenger ...
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Bourns introduces five new automotive-grade SMD fuse models

2020-07 Passive Components Bourns
[Jul 25 2020] Bourns has further expanded the company's business with the new automotive-grade SMD fuse series product line. The five new SF-1206SA-W, SF-2410FPA-W, SF-2410FA-W, SF-0603HIA-M and SF-1206HIA-M model families are fully compliant with Burns' internal AEC-Q200 equivalent test procedures to ensure rugged performance in a variety of applications operating in specific harsh environments. The SF-1206SA ...
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TDK introduces ultrasonic time-of-flight sensors with extended sensing range

2020-07 Sensors TDK
[Jul 24 2020] TDK's MEMS ultrasonic technology utilizes a self-developed ToF sensor in a 3.5mm x 3.5mm package and combines a MEMS ultrasonic transducer and an energy-efficient digital signal processor (DSP) on a custom low-power mixed-signal CMOS ASIC. The sensor can be equipped with multiple ultrasonic signal processing capabilities, providing customers with industrial design solutions for a wide range of us ...
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ADI has partnered with Hyundai Motor to launch the industry's first fully digital road noise reduction system

2020-07 Power Analog Devices
[Jul 23 2020] Analog Devices has announced a strategic partnership with Hyundai Motor Company (HMC), which plans to introduce the automotive industry's first fully digital road noise reduction system using ADI Automotive Audio Bus (A2B) technology. Hyundai Motor also plans to adopt ADI's A2B technology more widely in the underlying audio connectivity and infotainment systems of its automotive products. Dr. Kan ...
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Western Digital has successfully developed the fifth generation of 3D NAND technology, BiCS5

2020-07 Power Weidmuller
[Jul 22 2020] Western Digital Corporation announced that it has successfully developed BiCS5, the fifth generation of 3D NAND technology, continuing to provide the industry with advanced flash memory technology to solidify its industry-leading position. BiCS5 is built on TLC and QLC technologies to deliver increased capacity, performance and reliability at a competitive cost. With the exponential growth of dat ...
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Marvell announces dual ports for data centers and 5G infrastructure

2020-07 Connectors Maxwell Technologies
[Jul 21 2020] Today, the rigorous timing requirements of 5G radios are driving greater timing accuracy, and the new 400GbE PHY devices feature Marvell's industry-leading 56G PAM4 SerDes technology, IEEE 802.1AE 256-bit MACsec encryption, and high-precision timestamps. With these comprehensive, innovative capabilities, network equipment manufacturers can provide solutions with greater throughput, better securit ...
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Diodes introduces secondary side multi-mode synchronous rectification MOSFET driver

2020-07 Connectors Diodes Incorporated
[Jul 20 2020] Diodes Incorporated announced the introduction of the APR348 Secondary side multimode synchronous rectifier MOSFET driver, designed for AC-DC rectifier circuits for general consumer applications, laptops, and USB adapters. The APR348 is capable of driving external MOSFETs in high - and low-side secondary synchronous rectifier configurations. This flexible and efficient device supports secondary s ...
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Micron delivers the world's first mass-produced low-power chip for the high-end smartphone market

2020-07 Semiconductors Micron Technology Inc.
[Jul 19 2020] Micron Technology has announced that it has delivered the world's first mass-produced low-power DDR5 DRAM chip, which will first be included in the upcoming Mi 10 smartphone. As Xiaomi's memory technology partner, Micron's LPDDR5 DRAM chips will deliver lower power consumption and faster data read speeds to meet consumers' growing demand for artificial intelligence (AI) and 5G capabilities in sma ...
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STMicroelectronics introduces a new product line of STM32H7 for smart devices

2020-07 Connectors STMicroelectronics
[Jul 18 2020] STMicroelectronics' latest STM32H7A3, STM32H7B3 and STM32H7B0 value series microcontrollers (MCUS) feature the processing performance, high storage capacity and energy savings of 280MHz Arm®Cortex®-M7 for designing the next generation of smart product devices. The new MCU power consumption is kept low, the entry-level product is in a cost-effective 64-pin QFP package, and the integration and real ...