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TDK introduces a new MEMS-based ToF sensor with expanded sensing range
2020-06
Sensors
TDK
[Jun 30 2020] TDK announced that it now has the option to select original equipment manufacturers (Oems) for its Chirp CH-201 MEMs-based ultrasonic time-of-flight (ToF) sensor with expanded sensing range. The ToF sensor uses a tiny ultrasonic transducer chip to emit ultrasonic pulses and then listens for the echoes returned from a target located in the sensor's field of view. By calculating distance based on u ...

Artesyn Embedded Power introduces high efficiency 1300W 1/4 brick power converter
2020-06
Semiconductors
Artesyn Embedded Technologies
[Jun 30 2020] Artesyn Embedded Power, a division of Advanced Energy, announced the introduction of a new 1300W 1/4 brick DC/DC power converter, model number BDQ1300, featuring the most efficient on-board 12V output for telecommunications, computing and server devices. There are also digital controls available. The BDQ1300 power converter has a rated efficiency of more than 97% and provides power for non-isolat ...

XP Power introduces high-voltage DC-DC power modules for scientific research and semiconductor applications
2020-06
Power
XP Power
[Jun 29 2020] XP Power has officially announced a new 30W DC-DC power module that can produce up to 6kVDC from a single 24VDC input. The HRL30 series provides a precise high-voltage output for a wide range of applications, including scientific research and semiconductor applications. The series has a total of 22 voltage modules to choose from, with fully controllable outputs from 0-200VDC to 0-6KVDC in both po ...

Silicon Labs introduces a new Bluetooth system-on-chip (SoC) solution
2020-06
Semiconductors
Silicon Labs
[Jun 29 2020] Silicon Labs announced the launch of a new Bluetooth system-on-chip (SoC) solution that combines market-leading security, wireless performance, energy efficiency, software tools and protocol stacks to meet the market demand for high-volume, battery-powered iot products. Its EFR32BG22 (BG22) SoC extends Silicon Labs' existing secure, ultra-low-power Wireless Gecko Series 2 platform and provides de ...

Renesas Electronics simplifies the design of the power supply for the panoramic camera system in the car
2020-06
Semiconductors
Renesas Electronics America
[Jun 28 2020] Renesas Electronics, a leading global supplier of semiconductor solutions, announced the introduction of a new, highly integrated power management IC (PMIC), ISL78083, which simplifies power design for multiple HD camera modules to reduce development cycles, BOM costs and supply chain risk. The on-board camera PMIC can support battery-powered directly (36-42V) or coaxially powered (15-18V) power ...

Maxim provides power and communication solutions for true wireless headphones
2020-06
Sensors
Maxim Integrated
[Jun 28 2020] Maxim announced the launch of the MAX20340, the industry's smallest 2-pin bi-directional DC powerline communications (PLC) device, which reduces the size of the power supply and communication interface of the charging base by 80% in ultra-low power portable and wearable applications. Powered and data communicating via a single line, the MAX20340 eliminates the pins and discrete components needed ...

Texas Instruments Jacinto 7 processors facilitate mass market applications for automotive ADAS
2020-06
Power
Texas Instruments
[Jun 27 2020] Texas Instruments introduces the new Jacinto 7 processor platform. The new Jacinto processor platform builds on TI's decades of automotive system and functional safety knowledge with enhanced deep learning capabilities and advanced network processing to address design challenges in advanced driver assistance systems (ADAS) and automotive gateway applications. The first two automotive-grade chips ...

Qorvo launches the industry's first integrated front-end module
2020-06
Power
Qorvo US Inc.
[Jun 27 2020] Qorvo, a leading provider of RF solutions for mobile, infrastructure and aerospace and defense applications, has introduced the industry's first integrated Front-End module (iFEM), the QPF7219. When integrated into a Wi-Fi 6 (802.11ax) system, the module provides reliable network coverage throughout the home. iFEM combines Qorvo's advanced BAW filter technology with its unique edgeBoost (or flat ...

OmniVision introduces wafer-scale camera module
2020-06
Power
OmniVision Technologies Inc
[Jun 26 2020] OmniVision announced the OG0VA image sensor and OC0VA CameraCubeChip wafer-scale camera modules, expanding its family of back-illuminated sensors. The VGA series features the industry's smallest pixel size of 2.2 microns, and the OC0VA is the first CameraCubeChip with Nyxel technology. These sensors feature OmniVision's PureCel Plus-S stacked pixel architecture and Nyxel NIR technology for consum ...

The new hybrid surge protection provides multi-mode protection in a compact design
2020-06
Power
Bourns
[Jun 26 2020] Bourns, a leading manufacturer and supplier of electronic components, has announced the launch of the Bourns 1202 series. This Type 1 hardwired hybrid surge protector (SPD) is designed for AC infrastructure applications. Burns engineers have combined the company's fast-responding metal oxide rheostat (MOV) technology with low-leakage gas discharge tube (GDT) technology to provide a consistent, lo ...

TRINAMIC introduces low-voltage drives
2020-06
Power
Trinamic Motion Control GmbH
[Jun 25 2020] TRINAMIC Motion Control Ltd. announced the launch of the TMC7300, a low-voltage driver for one DC motor with peak current up to 2A, or two DC motors with peak current up to 2.4A. Powered by single or dual lithium-ion batteries or at least 2 AA batteries, the TMC7300 is ideal for use in battery-powered devices such as IoT and handheld devices, printers, POS applications, toys, cameras and mobile m ...

Maxim introduces a 50% smaller power management IC for automotive displays
2020-06
Semiconductors
Maxim Integrated
[Jun 25 2020] Maxim Integrated announced the launch of the MAX16923 4-output display power IC with watchdog timer to help automotive system designers increase the number of displays used and reduce design complexity. Using the MAX16923 single-chip power management solution instead of four or five discrete ics dramatically reduces the size of the solution, allowing the automotive industry to easily increase the ...