Support
sales@oemstron.com
86-755-83232896
English$ USD
Contact Us
TELEPHONE86-755-83232896
E-MAILsales@oemstron.com
SKYPEcondy@oemstron.com
QQ2881672436
MessageLeave Your Message
Top

Technology Articles

Records 5,530
Page 381/461
Article Cover

CEVA supports Bluetooth Low Energy audio to accelerate product development of truly wireless stereo earbuds

2020-07 Power CEL
[Jul 2 2020] CEVA, the world's leading licensed manufacturer of wireless connectivity and smart devices, announced that with the general release of RivieraWaves Bluetooth Low Energy and dual-mode IP supporting low power Audio (LE Audio), the company has enhanced its offerings for developers of true wireless stereo (TWS) earbuds and other wireless audio devices. Low Power Audio is the next generation of Blueto ...
Article Cover

The STM32 system chip presented by ST accelerates the development of LoRa IoT smart devices

2020-07 Semiconductors STMicroelectronics
[Jul 1 2020] Promoting a sustainable world through smart infrastructure and logistics, smart industry and smart living, STMicroelectronics, the world's leading semiconductor supplier across multiple electronic applications, demonstrated the world's first LoRa system-on-a-chip (SoC) to connect smart devices to the Internet of Things (IoT) through long-range wireless technology. The STM32WLE5 system chip enable ...
Article Cover

TDK introduces a range of fault-tolerant motion sensing products for industrial applications

2020-07 Sensors TDK
[Jul 1 2020] TDK has introduced a new family of high-performance and fault-tolerant InvenSense Inertial Measurement Units (IMU) for industrial applications. The new IIM-46234 and IIM-46230 include multiple 6-axis sensors, each of which can measure three-dimensional linear acceleration and three-dimensional rotational angular velocity. The IIM-4623X product family has the ability to make accurate measurements ...
Article Cover

TDK introduces a new MEMS-based ToF sensor with expanded sensing range

2020-06 Sensors TDK
[Jun 30 2020] TDK announced that it now has the option to select original equipment manufacturers (Oems) for its Chirp CH-201 MEMs-based ultrasonic time-of-flight (ToF) sensor with expanded sensing range. The ToF sensor uses a tiny ultrasonic transducer chip to emit ultrasonic pulses and then listens for the echoes returned from a target located in the sensor's field of view. By calculating distance based on u ...
Article Cover

Artesyn Embedded Power introduces high efficiency 1300W 1/4 brick power converter

2020-06 Semiconductors Artesyn Embedded Technologies
[Jun 30 2020] Artesyn Embedded Power, a division of Advanced Energy, announced the introduction of a new 1300W 1/4 brick DC/DC power converter, model number BDQ1300, featuring the most efficient on-board 12V output for telecommunications, computing and server devices. There are also digital controls available. The BDQ1300 power converter has a rated efficiency of more than 97% and provides power for non-isolat ...
Article Cover

XP Power introduces high-voltage DC-DC power modules for scientific research and semiconductor applications

2020-06 Power XP Power
[Jun 29 2020] XP Power has officially announced a new 30W DC-DC power module that can produce up to 6kVDC from a single 24VDC input. The HRL30 series provides a precise high-voltage output for a wide range of applications, including scientific research and semiconductor applications. The series has a total of 22 voltage modules to choose from, with fully controllable outputs from 0-200VDC to 0-6KVDC in both po ...
Article Cover

Silicon Labs introduces a new Bluetooth system-on-chip (SoC) solution

2020-06 Semiconductors Silicon Labs
[Jun 29 2020] Silicon Labs announced the launch of a new Bluetooth system-on-chip (SoC) solution that combines market-leading security, wireless performance, energy efficiency, software tools and protocol stacks to meet the market demand for high-volume, battery-powered iot products. Its EFR32BG22 (BG22) SoC extends Silicon Labs' existing secure, ultra-low-power Wireless Gecko Series 2 platform and provides de ...
Article Cover

Renesas Electronics simplifies the design of the power supply for the panoramic camera system in the car

2020-06 Semiconductors Renesas Electronics America
[Jun 28 2020] Renesas Electronics, a leading global supplier of semiconductor solutions, announced the introduction of a new, highly integrated power management IC (PMIC), ISL78083, which simplifies power design for multiple HD camera modules to reduce development cycles, BOM costs and supply chain risk. The on-board camera PMIC can support battery-powered directly (36-42V) or coaxially powered (15-18V) power ...
Article Cover

Maxim provides power and communication solutions for true wireless headphones

2020-06 Sensors Maxim Integrated
[Jun 28 2020] Maxim announced the launch of the MAX20340, the industry's smallest 2-pin bi-directional DC powerline communications (PLC) device, which reduces the size of the power supply and communication interface of the charging base by 80% in ultra-low power portable and wearable applications. Powered and data communicating via a single line, the MAX20340 eliminates the pins and discrete components needed ...
Article Cover

Qorvo launches the industry's first integrated front-end module

2020-06 Power Qorvo US Inc.
[Jun 27 2020] Qorvo, a leading provider of RF solutions for mobile, infrastructure and aerospace and defense applications, has introduced the industry's first integrated Front-End module (iFEM), the QPF7219. When integrated into a Wi-Fi 6 (802.11ax) system, the module provides reliable network coverage throughout the home. iFEM combines Qorvo's advanced BAW filter technology with its unique edgeBoost (or flat ...
Article Cover

Texas Instruments Jacinto 7 processors facilitate mass market applications for automotive ADAS

2020-06 Power Texas Instruments
[Jun 27 2020] Texas Instruments introduces the new Jacinto 7 processor platform. The new Jacinto processor platform builds on TI's decades of automotive system and functional safety knowledge with enhanced deep learning capabilities and advanced network processing to address design challenges in advanced driver assistance systems (ADAS) and automotive gateway applications. The first two automotive-grade chips ...
Article Cover

The new hybrid surge protection provides multi-mode protection in a compact design

2020-06 Power Bourns
[Jun 26 2020] Bourns, a leading manufacturer and supplier of electronic components, has announced the launch of the Bourns 1202 series. This Type 1 hardwired hybrid surge protector (SPD) is designed for AC infrastructure applications. Burns engineers have combined the company's fast-responding metal oxide rheostat (MOV) technology with low-leakage gas discharge tube (GDT) technology to provide a consistent, lo ...