Technology Articles

2020-11 Power Intel

[Nov 30 2020] Intel has unveiled new details about Thunderbolt™ 4, its next-generation universal cable connectivity solution, which aims to increase minimum performance requirements, expand functionality, and better meet USB4 specification requirements. Thunderbolt 4 will be groundbreaking in offering docking stations with up to four Thunderbolt ports and up to 2 meters of universal cable. Thunderbolt 4 will b ...

2020-11 Passive Components Vishay

[Nov 29 2020] Vishay Intertechnology introduces a new 30 V N-channel MOSFET half-bridge power stage This power stage combines high-end TrenchFET MOSFETs and low-end SkyFET MOSFETs with Schottky diodes in a compact PowerPAIR 3.3mm x 3.3mm package. For power conversion in computing and telecommunications applications, the Vishay Siliconix SiZF300DT offers higher power density and efficiency while reducing the nu ...

2020-11 Connectors TE Connectivity

[Nov 29 2020] TE Connectivity has added ultra-rugged Circular connectors (XRC), Sealed Rectangular connectors (SRC), ML-XT connectors and XRC terminals to its connectivity solutions portfolio. These connector products (formerly manufactured by Molex) are ideal for harsh environment applications. As a global industry technology leader in building a safer, sustainable, efficient and connected future, TE will con ...

2020-11 Connectors TE Connectivity

[Nov 29 2020] TE Connectivity (TE), a global connectivity and sensor leader, will introduce the KILOVAC K250 high voltage DC contactor. TE's new contactors are designed for harsh environments with a fully sealed design and deliver higher current carrying capacity and isolation voltage than other contactors of the same size and weight on the market. The KILOVAC K250 contactor has a continuous current rating of ...

2020-11 Sensors TE Connectivity

[Nov 28 2020] There is a growing demand for low-voltage sensing capabilities in the industrial and medical markets. From heating ventilation and air conditioning (HVAC) and airflow to continuous positive airway pressure (CPAP), ventilation and patient monitoring applications, the ability to detect small pressure changes is critical. This demand requires pressure sensors to be highly accurate, to provide long-t ...

2020-11 Power Renesas Electronics America

[Nov 28 2020] Renesas Electronics has announced that Continental has adopted the Renesas high-performance System-on-chip (SoC) R-Car M3 for its first generation body high-performance computer (HPC). HPC serves as an on-board computing platform that provides centralized control of vehicle systems and is equipped with security gateway capabilities to enable cloud connectivity. The R-Car M3 supports online (OTA) ...

2020-11 Connectors STMicroelectronics

[Nov 28 2020] STMicroelectronics and licensed partner Stackforce Corporation have jointly released a wireless remote meter reading system M-Bus(wM-Bus) bus software stack. Using the sub-GHz RF module integrated with the STM32WL microcontroller and various supported modulation schemes, the communication protocol stack can collect meter data wirelessly and remotely, saving material costs and improving design fle ...

2020-11 Connectors STMicroelectronics

[Nov 27 2020] The STNRGPF02, a new power IC for dual-channel staggered boost PFC topologies, is added to the STMicroelectronics digital Power controller family. Customers can easily configure the IC using the eDesignSuite software. The software also helps customers quickly complete circuit design and external component selection. The STNRGPF02 allows applications from 600W to 6kW to enjoy the benefits of digit ...

2020-11 Connectors Renesas Electronics America

[Nov 27 2020] Renesas Electronics announced the expansion of its RE family of ultra-low-power embedded controllers with the introduction of the Arm® Cortex®-M0+ core based on Renesas' breakthrough SOTBTM (Silicon on Thin Buried Oxide) process. The newest member of the RE01 group is equipped with 256KB of flash memory, which is different from existing products that have been mass-produced and integrated with 1. ...

2020-11 Power Amphenol Advanced Sensors

[Nov 27 2020] Ampleon announced the addition of two new products - the BLF978P and BLF974P - to its 9th generation of high-performance 50V Si LDMOS high efficiency RF power transistors. Both products are designed for ultra-high power RF power amplifiers that deliver hundreds of kilowatts of power with high efficiency and high gain characteristics. In Class AB operating conditions, both power transistors offer ...

2020-11 Power Flex Power Modules

[Nov 26 2020] Flex Power Modules works closely with OpenRAN and the O-RAN Alliance, a global community of more than 160 mobile operators, suppliers, and research and academic institutions operating in the wireless Access network (RAN) industry. As a result, Flextronics power modules continue to increase their presence in the relevant RFPA (Radio frequency Power amplifier) market, and the range of RFPA isolated ...

2020-11 Semiconductors United Chemi-Con

[Nov 26 2020] New power semiconductor company United Silicon Carbide Corporation (UnitedSiC) has introduced four new SiC FETs with RDS (ON) values as low as 7mΩ and offer unprecedented performance and high efficiency. Suitable for high-power applications such as electric vehicle (EV) inverters, high-power DC/DC converters, high-current battery chargers and solid-state circuit breakers. Of the four new UF3C SiC ...