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NXP announces WiFi/Bluetooth connectivity solutions based on the i.MX RT crossover processor
2020-12
Semiconductors
NXP
[Dec 7 2020] NXP said its Wi-Fi and Wi-Fi/Bluetooth combination and i.MX-RT MCU crossover processors are now supported in its MCUXpresso software, greatly simplifying product development. As a result, NXP will be able to expand the connectivity capabilities of its EdgeVerse edge computing and security platform. By pre-integrating driver support in the MCUXpresso SDK, NXP will provide developers with a flexibl ...

ST FlightSense time-of-flight proximity and detection sensors to help innovate social distance-sensing applications
2020-12
Sensors
STMicroelectronics
[Dec 6 2020] STMicroelectronics uses its high-precision proximity detection and ranging sensors to help customers develop innovative infectious disease protection equipment to meet the challenges posed by global outbreaks. Amsterdam-based startup Aura Aware has developed a portable smart social distance-sensing device using ST's FlightSense time-of-flight (ToF) technology. The device, suitable for retail coun ...

ON Semiconductor uses Veridify technology to provide secure end-to-end Bluetooth low power solutions
2020-12
Semiconductors
ON Semiconductor
[Dec 6 2020] ON Semiconductor, driving energy efficient innovation, announced that Veridify's Public Key security tool is immediately available for RSL10, the industry's lowest-power, flash-based Bluetooth low-power radio system single-chip (SoC). Veridify Security's tools, available in the form of CMSIS-Pack, provide developers with a familiar and fast implementation path to secure their RSL10 scenarios, pro ...

Cypress mass-produces the low-cost, low-risk PSoC 64 AWS MCU
2020-12
Semiconductors
Cypress Semiconductor
[Dec 6 2020] Cypress Semiconductor, a division of Infineon Technologies, announced that its PSoC 64 Standard Secure Amazon Web Services (AWS) MCU is now in volume production. The new MCU includes pre-proven security firmware that significantly reduces design risk and development costs, accelerating time-to-market. The MCU builds on the released PSoC 64 Secure Boot MCU family, integrates the Trusted Firmware-M ...

Dialog joins TDK to create the world's smallest point-of-load DC-DC converter solution
2020-12
Semiconductors
Dialog Semiconductor GmbH
[Dec 5 2020] Dialog Semiconductor announced a partnership with TDK, a global leader in smart society electronics solutions, to combine Dialog's GreenPAK technology in TDK's latest µPOL™ power solution family to create the world's first monolithic integrated system power timing solution. Traditional discrete solutions on the market today require a range of components, take up more board space, affect system re ...

Ams introduces the world's smallest proximity/light sensor module, enabling phone manufacturers to reduce bezel width
2020-12
Sensors
ams
[Dec 5 2020] Ams launches the world's smallest integrated ambient light sensor (ALS) and proximity detection module to serve the mid-market for handset Oems to develop mobile devices with edge-to-edge displays. Compared to similar devices on the market today, the TMD2755 module is 40% smaller in area and 64% smaller in volume. The TMD2755 provides a complete integrated three-in-one sensor solution that simpli ...

Maxim introduces an ultra-low power dual-core microcontroller with BLE 5.2
2020-12
Connectors
Maxim Integrated
[Dec 5 2020] Maxim Integrated announced the launch of the MAX32666 microcontroller (MCU) with wireless connectivity, helping designers reduce the cost of BOM for button battery-powered Internet of Things (IoT) products by one-third, and significantly save space and extend battery life. Featuring a floating-point computing unit (FPU) and Bluetooth Low Energy 5.2 (BLE 5.2), this ultra-low-power dual-core Arm® C ...

Infineon introduces a new sensing and balancing IC for battery management systems in electric vehicles
2020-12
Semiconductors
Infineon Technologies
[Dec 4 2020] Infineon Technologies further expands its portfolio of products for battery management systems with the introduction of a new sensing and balancing IC (TLE9012AQU). The device is specifically designed for batteries in hybrid and electric vehicles, but is also suitable for other applications. It can measure the voltage of up to 12 cells, and over its lifetime, the device is capable of measuring ac ...

TDK uses Sensirion's latest humidity and temperature sensors in SmartBug
2020-12
Sensors
TDK
[Dec 4 2020] TDK's SmartBug™ (MD-42688-P) is a multi-sensor wireless module that utilizes TDK MEMS sensors and algorithms to meet a wide range of IoT applications. The module combines six sensors, a powerful wireless (BLE) MCU, seven algorithm-driven functions and a rechargeable battery in a small ladybug enclosure. It also comes with an add-on board option that includes a Wi-Fi module, an SD card slot, and T ...

EPC and Microchip work together to develop high power density computing applications and data centers
2020-12
Power
Microchip Technology
[Dec 4 2020] The combination of Microchip Technology Inc. 's digital Signal Controller (DSC) and EPC Power Conversion Corporation's (EPC) ultra-efficient gallium nitride field-effect transistor (eGaN®FET) enables the optimal power density (730 W/in3) for efficient, low-cost DC-DC conversion. EPC announced the launch of the 1/16 brick, 300 W DC/DC Voltage Regulator (EPC9143). The EPC9143 power module integrate ...

ST launches STM32 Discovery Suite and extended software to simplify iot node networking and security feature development
2020-12
Power
STMicroelectronics
[Dec 3 2020] To simplify the complex software development challenges faced by iot node developers, ST has introduced the B-L4S5I-IOT01A STM32 Discovery Suite. The new suite includes the standards-certified FreeRTOS™ operating system programming interface, which is fully integrated within the STM32Cube development ecosystem and directly connects to Amazon Web Services (AWS). Hardware tools include an STM32L4+ ...

TE Connectivity offers a suite of solutions for hybrid and electric vehicles
2020-12
Power
TE Connectivity
[Dec 3 2020] Design engineers no longer have to worry about missing parts, difficult assembly or unattainable order quantities thanks to new, affordable options for high-voltage terminals and connectors from TE Connectivity, the global leader in connectivity and sensors. The new hybrid and electric vehicle solution suite includes all the reliable parts TE has always offered for harness assembly, but now in on ...