Technology Articles

2020-12 Sensors TDK

[Dec 4 2020] TDK's SmartBug™ (MD-42688-P) is a multi-sensor wireless module that utilizes TDK MEMS sensors and algorithms to meet a wide range of IoT applications. The module combines six sensors, a powerful wireless (BLE) MCU, seven algorithm-driven functions and a rechargeable battery in a small ladybug enclosure. It also comes with an add-on board option that includes a Wi-Fi module, an SD card slot, and T ...

2020-12 Power TE Connectivity

[Dec 3 2020] Design engineers no longer have to worry about missing parts, difficult assembly or unattainable order quantities thanks to new, affordable options for high-voltage terminals and connectors from TE Connectivity, the global leader in connectivity and sensors. The new hybrid and electric vehicle solution suite includes all the reliable parts TE has always offered for harness assembly, but now in on ...

2020-12 Power STMicroelectronics

[Dec 3 2020] To simplify the complex software development challenges faced by iot node developers, ST has introduced the B-L4S5I-IOT01A STM32 Discovery Suite. The new suite includes the standards-certified FreeRTOS™ operating system programming interface, which is fully integrated within the STM32Cube development ecosystem and directly connects to Amazon Web Services (AWS). Hardware tools include an STM32L4+ ...

2020-12 Power Power Integrations

[Dec 3 2020] Power Integrations has announced the start of production of the InnoSwitch™3-AQ, an AEC-Q100 certified flyback switching IC with an integrated 750 V MOSFETs and secondary side detection. The newly certified device family is suitable for electric vehicle applications such as traction inverters, OBCs (on-board chargers), EMS (Energy Management DC/DC bus converters) and BMS (battery management syste ...

2020-12 Power Infineon Technologies

[Dec 2 2020] Infineon Technologies AG has added a 62mm industry standard module package to its 1200 V CoolSiC™ MOSFET module family. It uses a proven 62mm device half-bridge topology design, as well as grooved gate chip technology, to open the door for medium power applications in silicon carbide above 250kW (the power density limit of silicon IGBT technology in 62mm packages). Based on the traditional 62mm I ...

2020-12 Power STMicroelectronics

[Dec 2 2020] STMicroelectronics cooperated with Fingerprint Cards AB (Fingerprints), the world's leading biometric technology company, to develop advanced biometric system-on-card solution (BSoC) based on fingerprint recognition technology. In response to market demands to improve the security and convenience of non-receiving payment cards. The BSoC integrated system integrates the latest generation of secure ...

2020-12 Passive Components Vishay

[Dec 2 2020] Vishay Intertechnology has announced the launch of seven small ENYCAP double-layer energy storage capacitors for energy harvesting and backup power applications, with dimensions ranging from 10 mm x 20 mm to 12.5 mm x 40 mm and capacities ranging from 5 F to 22 F. The latest small ENYCAP series of capacitors, including standard 220 EDLC, reinforced 225 EDLC-R, high-voltage 230 EDLC-HV and reinfor ...

2020-12 Power Trinamic Motion Control GmbH

[Dec 1 2020] TRINAMIC Motion Control Ltd. announces the TMCM-1636. The TMCM-1636 was developed for drives with power up to 1000W and 60A RMS, making it ideal for use in robotics, laboratory and factory automation, manufacturing, patient care equipment (such as motorized bed chairs), and industrial drives. By embedding Trinamic's TMC4671 and TMC6100 integrated circuits, the new module enables high current loop ...

2020-12 Connectors STMicroelectronics

[Dec 1 2020] The STM32WB55 wireless microcontroller now supports Zigbee 3.0, which is based on the Zigbee PRO protocol stack, enabling developers to take advantage of the interoperate, energy efficient Zigbee networking technology to develop home automation, smart lighting, smart buildings, and other broader iot connectivity projects. Zigbee 3.0 integrates the networking capabilities of consumer electronics a ...

2020-12 Power Infineon Technologies

[Dec 1 2020] Durability determines the service life and reliability of modules in harsh environments. Especially when exposed to hydrogen sulfide (H2S), the life of electronic components can be greatly affected. To counter this threat, Infineon Technologies has developed a unique protection feature. The EconoPACK™+ module with TRENCHSTOP™ IGBT4 chipset is the first in the Econo family to feature this new prot ...

2020-11 Sensors Renesas Electronics America

[Nov 30 2020] Renesas Electronics has announced the launch of the ZSSC4132, an automotive pressure sensor solution with an integrated LIN v2.2a interface and automotive grade certification. The single-package sensor Signal conditioning chip (SSC) is a compact form factor that offers superior performance, a highly flexible design, and a cost-effective solution for applications such as HVAC (heating, ventilation ...

2020-11 Passive Components KEMET

[Nov 30 2020] KEMET(" KEMET "or the" Company "), a subsidiary of Yageo Corporation(" Yageo "), a leading global supplier of electronic components, announced three new families of metallized polypropylene dielectric film capacitors :C44U-M, C44P-R and R75H. With an aluminum can design, both the C44U-M and C44P-R power film series meet the growing demand for high-power conversion systems in green energy and indu ...