Technology Articles

2024-03 Passive Components Vishay

[Mar 19 2024] Vishay Intertechnology has announced the launch of a new family of surge limiting positive temperature coefficient (PTC) thermistors, PTCEL. Vishay BCcomponents PTCEL Series devices with a wide resistance range at 25 °C (R25), high voltage handling and high energy absorption capabilities improve the performance of active charge and discharge circuits for automotive and industrial applications. Th ...

2024-03 Power Nexperia

[Mar 18 2024] Nexperia has announced a new family of 4 - and 8-channel analog switches dedicated to monitoring and protecting 1.8V electronic systems. The family of multiplexers includes AEC-Q100 certified models for automotive applications, as well as standard versions for a wider range of consumer and industrial applications, such as sensor monitoring and diagnostics, enterprise computing, and home appliance ...

2024-03 Connectors Infineon Technologies

[Mar 17 2024] Artificial intelligence (AI) is driving a doubling of global data generation, driving the increasing demand for energy for the chips that support this data growth. Infineon Technologies AG has launched the TDM2254xD series of biphase power modules to provide improved power density, quality and total cost (TCO) for AI data centers. The TDM2254xD series combines powerful OptiMOSTM MOSFET technology ...

2024-03 Connectors Renesas Electronics America

[Mar 16 2024] Renesas Electronics has announced the launch of a new product for high-performance robotics applications, the RZ/V2H, further expanding its popular RZ family of microprocessors (MPUs). The RZ/V2H delivers the highest level of performance in the product family, enabling visual AI and real-time control. The RZ/V2H is equipped with Renesas' new proprietary AI accelerator DRP-AI3 (Dynamically Configu ...

2024-03 Connectors Qorvo US Inc.

[Mar 15 2024] Qorvo, the world's leading provider of connectivity and power solutions, has announced the launch of four 1200V silicon carbide (SiC) modules in a compact E1B package, two in half-bridge configurations and two in full-bridge configurations with a minimum on-resistance RDS(on) of 9.4mΩ. The new high-efficiency SiC modules are ideal for applications such as electric vehicle charging stations, energ ...

2024-03 Power Nexperia

[Mar 14 2024] Nexperia is once again showcasing product innovation at APEC, announcing the release of several new MOSFETs to further broaden its range of discrete switching solutions for a variety of applications across multiple end markets. The announcement includes 100 V application-specific MOSFETs (ASFETs) for PoE, eFuse and relay replacement products in a DFN2020 package with a 60 percent reduction in siz ...

2024-03 Power Vishay

[Mar 13 2024] Vishay Intertechnology announced, Introduced five new half-bridge IGBT power modules in an improved INT-A-PAK package -VS-GT100TS065S, VS-GT150TS065S, VS-GT200TS065S, VS-GT100TS065N and VS-GT200TS065N. Manufactured using Vishay's Trench IGBT technology, these new devices offer designers two industry-leading technology options - low VCE(ON) or low Eoff - to reduce high current inverter level on-of ...

2024-03 Power Micron Technology Inc.

[Mar 12 2024] Micron Technology has announced the start of shipping an enhanced Universal Flash Memory (UFS) 4.0 mobile solution featuring breakthrough proprietary firmware features and an industry-leading compact UFS package (9 x 13mm). Based on advanced 232-layer 3D NAND technology, Micron's UFS 4.0 solution can achieve up to 1 TB of capacity, and its superior performance and end-to-end technology innovation ...

2024-03 Connectors Microchip Technology

[Mar 11 2024] To enable efficient, real-time embedded motor control systems in space-constrained applications, Microchip Technology is introducing a new family of integrated motor drivers based on dsPIC Digital Signal Controllers (DSC). The family of devices integrates a dsPIC33 digital Signal controller (DSC), a three-phase MOSFET gate driver, and optional LIN or CAN FD transceivers in a single package. A sig ...

2024-03 Connectors STMicroelectronics

[Mar 10 2024] St's power MOSFETs and IGBT gate drivers are designed to provide the perfect combination of robustness, reliability, system integration and flexibility. These drivers feature integrated high-voltage half-bridges, single and multiple low-voltage gate drivers, making them ideal for a variety of applications. When it comes to ensuring safety control, the STGAP family of isolated gate drivers is the ...

2024-03 Power ON Semiconductor

[Mar 9 2024] Onsemi, a leader in smart power and intelligent perception technologies, announced the introduction of the 1200V SPM31 Smart Power Module (IPM) with a new field-cutoff 7th generation (FS7) insulated gate bipolar transistor (IGBT) technology. Compared to other leading solutions on the market, the SPM31 IPM is more energy efficient, smaller in size, and more power dense, resulting in a lower overal ...

2024-03 Power Qualcomm

[Mar 8 2024] Qualcomm continues to lead the pace of innovation by announcing the launch of its seventh generation 5G modem to antenna solution, the Snapdragon X80 5G modem and RF System. The Snapdragon X80 integrates a dedicated 5G AI processor and 5G Advanced-ready architecture, achieving several world-first milestones, These include the first integration of NB-NTN satellite communications in 5G modems, the ...