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Technology Articles

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Maxim introduces highly integrated single-chip security monitors

2019-07 Power Maxim Integrated
[Jul 4 2019] Maxim introduces the MAX36010 and MAX36011 highly integrated single-chip security monitors to provide Internet of Things (IoT) product designers with a smarter and more secure way to effectively protect stored sensitive information. These security solutions make it easy for designers to achieve reliable tamper-proof detection, secure encryption and storage without becoming security experts, and s ...
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The first destruction-proof seal switch specifically designed for harsh environments and remote locations

2019-07 Power C&K
[Jul 3 2019] C&K announces the ATP19 and ATP22 series of destruction-proof seal push switches. The new series of high-strength lightweight switches are IP67/IK10 compliant, making them suitable for harsh applications and resistant to possible damage. The switches are also corrosion resistant and are available in industry standard ring with lamp versions with diameters of 19mm and 22mm respectively. The ATP19 ...
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AMETEK Programmable Power Division announces new 4U High 4.5kVA/6kVA AC-DC power supply products

2019-07 Power Ametherm
[Jul 2 2019] AMETEK's programmable Power division has released two new models of the Asterion family of AC-DC power supplies, Asterion4503 and Asterion6003. The Asterion4503 offers 4500VA or 4500W power output, and the Asterion6003 offers 6000VA or 6000W power output. Both models are 4U rack height with both single-phase and three-phase output capabilities. Using the 1U/2U height low power Asterio series AC a ...
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Micropitch FPC connectors for consumer electronics

2019-07 Connectors TE Connectivity
[Jul 1 2019] In light of the ongoing trend toward miniaturization in consumer devices, TE Connectivity (TE), formerly Tyco Electronics, today announced its latest 0.25mm pitch flexible printed circuit (FPC) connector (FPC slant). All TE 0.25mm pitch FPC connectors are RoHS compliant (Hazardous Substance Content Restriction). Micropitch FPC connectors can be used on smaller printed circuit boards (PCBS) with m ...
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Microchip introduces solutions based on PolarFire FPGas

2019-06 Semiconductors Microchip Technology
[Jun 30 2019] To ensure that systems can capture and display information and high-resolution images, today's video and image processing requires the development of complex computer algorithms. Because designers need high-performance computing, storage, and connectivity resources to achieve detailed, vivid, high-resolution images, field-programmable gate arrays (FPgas) perform thousands of tasks while ensuring ...
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New smart health sensors for mobile consumer devices

2019-06 Sensors ams
[Jun 28 2019] Ams has introduced the AS7026, an optical sensor for continuous monitoring of cardiovascular health, with medical-grade 1 precision measurement of blood pressure. Combined with AMS 'VivaVita™ accessory design, it provides turnkey solutions for customers who need to reduce time to market, creating feature-rich mobile applications for iOS and Android™ mobile operating systems. Embed the AS7026 into ...
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NXP Semiconductor announces new in-car networking chipsets that offer new services

2019-06 Semiconductors NXP
[Jun 27 2019] NXP Semiconductors today announced the release of an in-vehicle network processing chipset that can be used as a high-performance service-oriented gateway to unlock the value of connected vehicle data and offer new services. The MSC-LS chipset solution combines NXP Semiconductor's MPC5748G automotive microcontroller and LS1043A enterprise network communications processor to provide the high perfo ...
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TI introduces new embedded processors and analog chips based on bulk acoustic wave (BAW)

2019-06 Power Texas Instruments
[Jun 26 2019] Texas Instruments announced the introduction of a new embedded processor and analog chip based on bulk acoustic wave (BAW), which is ideal for applications in the design of the next generation wireless Internet of Things and communications infrastructure. The two devices developed using TI BAW technology are the CC2652RB SimpleLink wireless microcontroller (MCU) and the LMK05318 network synchroni ...
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Infineon introduces the fourth-generation REAL3 image sensor

2019-06 Sensors Infineon Technologies
[Jun 25 2019] Infineon presents the fourth-generation REAL3 image sensor IRS2771C. The 3D Time of Flight (ToF) single-chip device is designed to meet the needs of the mobile consumer end market, particularly the need to support higher resolutions with small lenses. A wide range of applications include secure user authentication (such as face recognition or hand recognition) to unlock devices and confirm paymen ...
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Vishay extends the IHSR series of high-saturation commercial inductors

2019-06 Sensors Vishay
[Jun 24 2019] Vishay extends the IHSR family of high-saturation commercial inductors with the introduction of the latest ultra-thin package of 4 mm x 4 mm 1616 form factor, the IHSR-1616AB-01. The Vishay Dale IHSR-1616AB-01 is designed for multiphase high-current power supplies and filters for computer, industrial, and communications applications, with a DC resistance (DCR) of 50% lower than a typical power in ...
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DustPhotonics introduces 400Gbps QSFP-DD active optical cable

2019-06 Power Daburn Electronics
[Jun 23 2019] DustPhotonicsTM announces that it has conducted a sample inspection of 400G active optical cables of QSFP-DD specification and completed all pre-production procedures. The 400Gbps active optical cable uses DustPhotonics' AuraDPTM optical engine and unique fiber integration and production technology to provide a competitive solution for short-range high-density multimode fiber applications. DustPh ...
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Ams introduces new color proximity and flicker detection sensors

2019-06 Sensors ams
[Jun 22 2019] Ams announced the introduction of its new color (RGB) proximity and flicker detection sensor, the TCS3707, which enables mobile phone cameras to take crisp and flawless photos in artificially lit scenes. The sensor has built-in infrared crosstalk suppression for reliable proximity detection when paired with an infrared transmitter. Available in 2.0mm x 2.5mm x 0.5mm OQFN package. A phone camera e ...