Technology Articles

2015-01 Semiconductors Cypress Semiconductor

[Jan 4 2015] Cypress Semiconductor today announced that its EZ-USB HX3 USB 3.0 hub controller is available in a small package. The 6 mm x 6 mm spherical solder Array (BGA) package saves board space on ultrabooks, tablets, portable port extenders, and other mobile and consumer devices, while offering the best feature set in the HX3 controller industry, such as strong interoperability, extended charging support ...

2015-01 Power Microsemi

[Jan 4 2015] Microsemi Corporation, a leading provider of differentiated semiconductor technology solutions in terms of power, safety, reliability and performance, announced a partnership with New Wave Design & Verification (New Wave) DV) collaborates to develop networking hardware and Fibre Channel IP cores. Both the PMC/XMC card and the IP kernel are now available for SmartFusion2 SoC FPGas and IGLOO2 FPgas ...

2015-01 Semiconductors Microchip Technology

[Jan 3 2015] Microchip Technology, a leading global provider of integrated microcontroller, mixed-signal, emulator and flash patented solutions, announced the addition of Qobuz Connect connectivity support to Microchip's JukeBlox platform. With this combined solution, HD quality and true CD quality audio can be transmitted directly to wireless speakers and AV receivers, providing users with a wonderful and en ...

2015-01 Connectors Diodes Incorporated

[Jan 3 2015] Diodes offers a wide range of synchronous step-down converters, including the AP65450, AP65452 and AP65552, for low output voltage power regulation in digital TVS, displays and other rapidly changing high-density point-of-load system architectures. The new device uses adaptive constant on-time control to ensure high precision DC output, high efficiency and fast transient response. The AP65450 is ...

2015-01 Semiconductors Newhaven Display Intl

[Jan 2 2015] Ultra-low power (ULP) radio frequency (RF) specialist Nordic Semiconductor ASA announced the nRF51 Internet of Things (IoT) Software development Kit (SDK), This is the complete IPv6-ready Internet protocol suite for the market-leading Nordic nRF51 family of system-on-a-chip (SoC), Take advantage of the Bluetooth SIG's newly adopted Internet Protocol Support Profile, IPSP) and 6LoWPAN technology o ...

2015-01 Power Molex

[Jan 2 2015] Molex Corporation has won the 2014 Chicago Innovation Award for its development of a connector system that provides electrical connectivity for Dow Chemical's POWERHOUSE solar roof panel. Molex interconnect systems have helped Dow bring ground-breaking new solar roof solutions to residential consumers across the United States and Canada. Jeff Gaumer, New Product Development Manager at Molex, said ...

2015-01 Connectors Diodes Incorporated

[Jan 1 2015] Diodes Incorporated introduces the PAM2322AGEAR, a dual buck converter that offers a pair of high-efficiency pulse-width modulated buck DC/DC converters in a 2.5mm x 2.00mm miniature package designed to meet the requirements of wireless and DSL modem applications. The device's innovative pulse jump mode minimizes static current under light load operation, helping to extend the battery life of por ...

2015-01 Power Power Integrations

[Jan 1 2015] Power Integrations, the leader in high-efficiency, high-reliability LED driver ics, has introduced a new reference design for LED street lights, industrial lamps and other high-power LED lighting applications. The new reference design RDR-382 introduces a constant current, 43 V(rated), 150 W reference Power supply designed using Power Integrations' HiperPFS™-2 PFC controller IC and HiperLCS™ inte ...

2010-07 Connectors ON Semiconductor

[Jul 16 2010] ON Semiconductor introduces a new family of four devices that promote the high level of performance and innovative features that automotive manufacturers and consumers now expect from automotive exterior and interior lighting. The new series is specifically aimed at low-power solid-state lighting and includes two LED drivers (NCV7683 and NCV7685) and two current controllers (NCV7691 and NCV7692). ...

2010-02 Power Toshiba Semiconductor and Storage

[Feb 3 2010] Toshiba Electronics Corporation announced the launch of two new families of NVMe/PCIe 3.0 Gen3x4 M.2 solid state drives (SSDS) : the RD500 and RC500 series. Both product lines feature Toshiba Memory Corporation's most advanced 96-layer TLC(third-level storage unit)BiCS FLASH 3D memory. Toshiba Memory Corporation's new SSDS offer high-performance solutions aimed at today's mainstream gamers, do-it ...

2010-01 Power Nexperia

[Jan 10 2010] Nexperia announced that key components in its family of high-performance, general-purpose transistors and switching diodes packaged in SOT23 are now fully established to operate at temperatures up to 175 ° C. The product range includes the industry's most popular high-speed switching diode BAS16/21 and BC807/817 general-purpose transistors. The 175 ° C SOT23 device also has 25% higher Ptot (total ...

2010-01 Passive Components Microchip Technology

[Jan 9 2010] To address the electromagnetic interference (EMI) and electromagnetic compatibility (EMC) issues facing automotive touchscreen developers, Microchip Technology has introduced three new maXTouch touchscreen controllers and additional optimization services. The new TD series touch controllers feature a new differential interactive signal acquisition technology that significantly improves the signal ...