Technology Articles

2020-08 Power Power Integrations

[Aug 30 2020] Power Integrations introduces the LinkSwitc-TN2 series of ics for non-isolated offline power supplies that are highly integrated (built-in MOSFETs and controllers) and offer significant performance and space savings over conventional linear or capacitive step-downs. The built-in semiconductor in all devices, in addition to the traditional voltage of 725V, is launched up to 900V MOSFET, making the ...

2020-08 Power Infineon Technologies

[Aug 30 2020] Infineon Technologies AG has partnered with Qualcomm to develop a 3D certified reference design based on the Qualcomm Snapdragon 865 mobile platform, further expanding the range of applications of Infineon's 3D sensor technology in mobile devices. This reference design uses the REAL3TM 3D time-of-flight (ToF) sensor to enable smartphone manufacturers to achieve standardized integration that is co ...

2020-08 Optoelectronics ams

[Aug 29 2020] Pictures have become an important way for people to express themselves on social media. In pursuit of the "perfect image," more and more apps offer filters or editing capabilities to enhance the image. Despite the proliferation of innovations in smartphone photography, there are still some image effects that can only be achieved with professional cameras and complex and expensive lenses. Osram in ...

2020-08 Passive Components Murata

[Aug 29 2020] Murata BBSC/UBSC/ULSC ultra-wideband SMT silicon capacitors target optical communication systems (ROSA/TOSA, SONET and all optoelectronic components) as well as high-speed data systems or products. These capacitors are designed for DC blocking, coupling, and bypass grounding applications. These silicon capacitors have low insertion loss, low reflection, and high phase stability over a wide freque ...

2020-08 Optoelectronics ams

[Aug 28 2020] Ams has announced the introduction of a new (IR) laser floodlight module, the Merano Hybrid, which is an ultra-compact package and integrates all the optoelectronic components of the (IR) laser floodlight and the VCSEL Driver of the vertical cavity surface emitting laser. Oems (original equipment Manufacturers) use this module to make it easier to implement popular 3D features. This is the latest ...

2020-08 Semiconductors STMicroelectronics

[Aug 28 2020] STMicroelectronics, a leading global semiconductor company, announced the introduction of the new FDA901 Class D audio amplifier integrated circuit, whose semiconductor design incorporates Alps Alpine Co., a major Japanese manufacturer of automotive audio equipment. Ltd.) world-class audio design expertise, and infocomm equipment. The goal of the new chip is to create a versatile, high-fidelity c ...

2020-08 Passive Components Murata

[Aug 27 2020] Murata ATSC Automotive high temperature silicon capacitors are targeted at under-hood electronic devices and sensors in harsh conditions in the automotive market sector. Deep grooved MOS capacitors, combined with a unique Mosaic structure and distributed grooved capacitors, achieve excellent electrical performance. Murata ATSC Automotive high temperature silicon capacitors are targeted at under-h ...

2020-08 Power SiTIME

[Aug 27 2020] SiTime, the market leader in MEMS silicon clock system solutions, has announced a 48-hour lead time for its MEMS oscillators, helping customers speed up design and reduce development efforts to generate revenue faster.Previously, customers had to wait up to 20 weeks and sometimes pay a one-time engineering fee (NRE) to get an oscillator configured to their specific requirements. SiTime's programm ...

2020-08 Semiconductors FTDI, Future Technology Devices International Ltd

[Aug 26 2020] Always at the forefront of embedded connectivity innovation, FTDI announces its latest series of multi-channel USB interface ics. As more and more hardware begins to use next-generation power protocols, this family of ics has the capability to handle these needs. The new high-speed (480Mbits/s) device is available in 2-channel (FT2233HP) and 4-channel (FT4233HP) versions with serial UART (RS232, ...

2020-08 Power CH Products

[Aug 26 2020] CISSOID announced its continued commitment to address the challenges of the automotive and industrial markets with the launch of a three-phase Silicon Carbide (SiC) MOSFET Smart Power Module (IPM) platform for electric vehicles. This new smart power module technology provides an all-in-one solution that integrates a three-phase water-cooled silicon carbide MOSFET module with a built-in gate drive ...

2020-08 Power SunLED

[Aug 25 2020] Super Micro Computer will launch the market's first outdoor edge system for 5G RAN, AI inference, and intelligent edge applications with IP65 protection level servers. The product will be powered by Intel Xeon D processors and second-generation Intel Xeon scalable processors, offering a variety of configuration options. The new system is suitable for harsh outdoor environments and supports the in ...

2020-08 Connectors Maxim Integrated

[Aug 25 2020] Maxim Integrated Products announced the launch of the MAX32520 ChipDNATM Secure Arm® Cortex-M4 microcontroller, which physically eliminates cloning (PUF) and is the industry's first secure microcontroller for financial and government applications. Maxim's PUF technology offers multiple layers of protection and is the industry's most advanced, high-performing key protection solution for IoT, healt ...