Technology Articles

2020-09 Semiconductors Texas Instruments

[Sep 1 2020] Texas Instruments introduces the industry's first new 40-A SWIFT DC/DC buck converter that can stack up to four integrated circuits (ics). The TPS546D24A PMBus buck converter delivers up to 160A output current at ambient temperatures of 85°C, four times higher than other power ics on the market. Among the many 40A DC/DC converters, the TPS546D24A is more efficient, reducing power consumption by 1 ...

2020-08 Semiconductors Vishay

[Aug 31 2020] Vishay Intertechnology has announced the introduction of A new IHDM automotive side wound through hole inductor, the IHDM-1008BC-3A, rated at up to 150 A for use in engine compartment environments. The Vishay Custom Magnetics IHDM-1008BC-3A uses iron powder core technology for excellent sensing and saturation stability, low power consumption and excellent thermal performance in the harsh operatin ...

2020-08 Power Silicon Labs

[Aug 31 2020] Silicon Labs has unveiled Secure Vault technology, a new suite of advanced security features designed to help connected device manufacturers address the escalating security threats and regulatory pressures of the Internet of Things (IoT). Silicon Labs' Wireless Gecko Series 2 platform takes full advantage of Secure Vault by combining best-in-class security software capabilities with Physically un ...

2020-08 Power Power Integrations

[Aug 30 2020] Power Integrations introduces the LinkSwitc-TN2 series of ics for non-isolated offline power supplies that are highly integrated (built-in MOSFETs and controllers) and offer significant performance and space savings over conventional linear or capacitive step-downs. The built-in semiconductor in all devices, in addition to the traditional voltage of 725V, is launched up to 900V MOSFET, making the ...

2020-08 Power Infineon Technologies

[Aug 30 2020] Infineon Technologies AG has partnered with Qualcomm to develop a 3D certified reference design based on the Qualcomm Snapdragon 865 mobile platform, further expanding the range of applications of Infineon's 3D sensor technology in mobile devices. This reference design uses the REAL3TM 3D time-of-flight (ToF) sensor to enable smartphone manufacturers to achieve standardized integration that is co ...

2020-08 Passive Components Murata

[Aug 29 2020] Murata BBSC/UBSC/ULSC ultra-wideband SMT silicon capacitors target optical communication systems (ROSA/TOSA, SONET and all optoelectronic components) as well as high-speed data systems or products. These capacitors are designed for DC blocking, coupling, and bypass grounding applications. These silicon capacitors have low insertion loss, low reflection, and high phase stability over a wide freque ...

2020-08 Optoelectronics ams

[Aug 29 2020] Pictures have become an important way for people to express themselves on social media. In pursuit of the "perfect image," more and more apps offer filters or editing capabilities to enhance the image. Despite the proliferation of innovations in smartphone photography, there are still some image effects that can only be achieved with professional cameras and complex and expensive lenses. Osram in ...

2020-08 Semiconductors STMicroelectronics

[Aug 28 2020] STMicroelectronics, a leading global semiconductor company, announced the introduction of the new FDA901 Class D audio amplifier integrated circuit, whose semiconductor design incorporates Alps Alpine Co., a major Japanese manufacturer of automotive audio equipment. Ltd.) world-class audio design expertise, and infocomm equipment. The goal of the new chip is to create a versatile, high-fidelity c ...

2020-08 Optoelectronics ams

[Aug 28 2020] Ams has announced the introduction of a new (IR) laser floodlight module, the Merano Hybrid, which is an ultra-compact package and integrates all the optoelectronic components of the (IR) laser floodlight and the VCSEL Driver of the vertical cavity surface emitting laser. Oems (original equipment Manufacturers) use this module to make it easier to implement popular 3D features. This is the latest ...

2020-08 Power SiTIME

[Aug 27 2020] SiTime, the market leader in MEMS silicon clock system solutions, has announced a 48-hour lead time for its MEMS oscillators, helping customers speed up design and reduce development efforts to generate revenue faster.Previously, customers had to wait up to 20 weeks and sometimes pay a one-time engineering fee (NRE) to get an oscillator configured to their specific requirements. SiTime's programm ...

2020-08 Passive Components Murata

[Aug 27 2020] Murata ATSC Automotive high temperature silicon capacitors are targeted at under-hood electronic devices and sensors in harsh conditions in the automotive market sector. Deep grooved MOS capacitors, combined with a unique Mosaic structure and distributed grooved capacitors, achieve excellent electrical performance. Murata ATSC Automotive high temperature silicon capacitors are targeted at under-h ...

2020-08 Semiconductors FTDI, Future Technology Devices International Ltd

[Aug 26 2020] Always at the forefront of embedded connectivity innovation, FTDI announces its latest series of multi-channel USB interface ics. As more and more hardware begins to use next-generation power protocols, this family of ics has the capability to handle these needs. The new high-speed (480Mbits/s) device is available in 2-channel (FT2233HP) and 4-channel (FT4233HP) versions with serial UART (RS232, ...