Technology Articles

2020-09 Power Xilinx

[Sep 7 2020] Xilinx, a global leader in adaptive and intelligent computing, announced the introduction of Versal™ Premium, the third product family in the Versal ACAP portfolio. With a highly integrated, power-optimized network core, the Versal Premium family is the industry's most bandwidth and computation-dense adaptive platform. Versal Premium is designed for running the highest bandwidth networks in therm ...

2020-09 Sensors Bourns

[Sep 6 2020] Bourns has announced the addition of four new models to the Bourns Precision Sensor (BPS) family. Based on the latest microelectromechanical systems (MEMS) technology, the four new BPS310, BPS320, BPS330 and BPS340 families deliver fast response, high resolution and long-term stability, making them the perfect solution for cost-effective pressure sensors. These BPS sensors measure pressure in the ...

2020-09 Semiconductors ON Semiconductor

[Sep 6 2020] ON Semiconductor expands its Wide band Gap (WBG) device family with the introduction of two more silicon carbide (SiC) MOSFETs. These new devices are suitable for a variety of demanding high-growth applications, including solar inverters, electric vehicle (EV) on-board charging, uninterruptible power supplies (UPS), server power supplies, and EV charging stations, providing a level of performance ...

2020-09 Power Power Integrations

[Sep 5 2020] Power Integrations expands its product lineup with the release of the new InnoSwitch™3 Series of constant voltage/constant displacement fly-back switching power supply ics. The new INN3x78C device incorporates a smaller "No. 8" 750 V PowiGaN transistor to create a lightweight, high-efficiency power supply capable of delivering 27 W to 55 W of output power without the need for heat sinks. Like the ...

2020-09 Power Micron Technology Inc.

[Sep 5 2020] Micron Technology announced the beginning of the industry's first Universal Flash Memory (UFS) multi-chip package (uMCP) product that also features low-power DDR5 (LPDDR5) DRAM. This uMCP product provides a high-density, low-power storage solution for thin and compact mid-range smartphone designs. Micron's new uMCP5 package incorporates the company's innovation and cutting-edge technology in mult ...

2020-09 Power NXP

[Sep 4 2020] NXP Semiconductors announced a new automotive digital key solution that enables smartphones, remote keys and other mobile devices to securely store, verify, securely communicate with and share digital keys with the vehicle. The solution expands the reach and convenience of car access by providing the security foundation needed to enable new features such as key sharing, multi-car access and confi ...

2020-09 Power XP Power

[Sep 4 2020] XP Power has officially announced two new families of ultra-wide range input DC-DC converters. Their flexible nature allows devices with incompatible voltages to be easily integrated into industrial systems. The DTJ15 and DTJ20 series are designed for easy installation and operation. They can be mounted on a plate or DIN rail and connected via screw terminals, requiring no additional components t ...

2020-09 Semiconductors Vishay

[Sep 3 2020] Vishay Intertechnology has announced the launch of a new automotive grade phototransistor coupler, the VOMA618A, in a compact SOP-4 miniature flat package with a current transfer ratio (CTR) of 50% to 600% and a forward current of only 1 mA. The Vishay Semiconductors VOMA618A forward current is 80% lower than the previous generation solution, helping to save energy in automotive and high-reliabil ...

2020-09 Power Nexperia

[Sep 3 2020] Nexperia announced the introduction of the PESD2V8R1BSF, the industry's first ESD protection device developed specifically for the USB4TM standard with industry-leading RF performance. The new device uses Nexperia's TrEOS ESD and active thyristor (SCR) technology, which will be of particular interest to USB4TM and Thunderbolt interface design engineers. The device enables very low capacitance (do ...

2020-09 Connectors Toshiba Semiconductor and Storage

[Sep 2 2020] Toshiba Electronic Components & Storage Corporation announced the launch of the "TLP5231," a pre-drive optocoupler for medium and large current insulated gate bipolar transistors (IGBTs) and MOSFETs for power regulation systems in industrial inverters and photovoltaics (PV). The new pre-driven optocoupler has a variety of built-in features, including overcurrent detection by monitoring the collec ...

2020-09 Semiconductors ON Semiconductor

[Sep 2 2020] ON Semiconductor, which drives energy efficiency innovation, introduces a connected lighting platform that leverage the company's expertise in Power over Ethernet (PoE) and ultra-low power Bluetooth low power connectivity and AC-DC and DC-DC power conversion design. The prototype platform enables the engineering team to explore and innovate in the field of connected lighting, making lighting devi ...

2020-09 Connectors Omron Electronics Inc-EMC Div

[Sep 1 2020] Omron has announced its new MOS FET (metal-oxide-semiconductor field-effect transistor, a type of field-effect transistor) relay module "G3VM-21MT", which will be the world's first electronic component to adopt a "T-circuit structure" (a circuit structure commonly used in electronic devices such as attenuators to minimize leakage current). The T-circuit structure consists of small, long-life soli ...