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Flex introduces 1100W brick DC/DC power module
2021-05
Power
Flex Power Modules
[May 2 2021] Flex introduces the BMR492 Series of brick DC/DC power modules that deliver 600 to 800W of continuous power. 800W converters in < Up to 1100 W of peak power for a short period of 1 s. Cpus in data communications and data center applications often require this burst mode operation. The first member of the BMR492 series of digital intermediate bus converters is the BMR4920302/861. The BMR4920302 ...

Renesas and LUPA introduce the EagleCAM module, an open front camera solution
2021-05
Power
Renesas Electronics America
[May 2 2021] Renesas Electronics, a leading provider of advanced semiconductor solutions, and LUPA-Electronics GmbH, a provider of automotive safety solutions, today announced the EagleCAM module, an open front-facing camera solution. Features R-Car V3H and R-Car V3M system-on-chip (SoC) devices from Renesas Electronics. The all-in-one scalable camera platform addresses the latest Euro NCAP and C-NCAP require ...

Microchip introduces COTS-based aerospace grade Radiation resistant Power converter
2021-05
Connectors
Microchip Technology
[May 2 2021] As reliance on communications and weather satellites grows, the scope and mission of space research is expanding, and new technologies are needed to help accelerate the design and production of space systems. Microchip Technology announced the expansion of its SA50-120 power converter family with nine new products based on commercial-grade off-the-shelf technology (COTS) to provide developers wit ...

Toshiba announces 18TB MG09 series hard disk drives
2021-05
Power
Toshiba Semiconductor and Storage
[May 1 2021] Toshiba Electronic Components and Storage Devices, Inc. (announced the launch of the 18TB MG09 series hard disk Drive (HDD), Toshiba's first HDD with energy-assisted magnetic recording. The MG09 series uses Toshiba's third-generation 9-disc helium seal design and Toshiba's innovative flux control-Microwave-assisted Magnetic Recording (FC-MAMR) technology to increase the traditional magnetic recor ...

Silicon Labs has introduced a new all-in-one isolation solution, the Si823Hx gate driver board
2021-05
Power
Silicon Labs
[May 1 2021] Silicon Labs has introduced a new all-in-one isolation solution, the Si823Hx gate driver board, which provides perfect support for the recently released Wolfspeed WolfPACK power module. Wolfspeed power modules can be used in numerous power applications, including electric vehicle (EV) chargers and motor drivers in industrial and automotive markets. The board contains the Si823Hx isolated gate dri ...

Samsung introduces 1.4-micron 50 megapixel ISOCELL GN2 sensor
2021-05
Sensors
Samsung
[May 1 2021] Samsung Electronics has unveiled a new generation of 50 megapixel ISOCELL GN2 image sensor with a large 1.4μm (micron) pixel. Compared to the previous generation ISOCELL GN1, the ISOCELL GN2 can achieve up to 100 million pixels of ultra-high definition photo output, and can improve the focus ability with the full pixel dual-core focus Pro technology. In addition, ISOCELL GN2 can also achieve more ...

Allegro introduces high-precision, high-output flexibility sensor interface ics for resistive bridge pressure sensors
2021-04
Semiconductors
Allegro MicroSystems, LLC
[Apr 30 2021] Allegro, a global leader in sensing technology and power semiconductor solutions for motion control and energy saving systems, announced the introduction of the automotive grade interface IC A17700 for resistive bridge pressure sensors, which builds on Allegro's decades of automotive sensor expertise. Industry-leading signal conditioning algorithms and flexible interface options are integrated to ...

Infineon introduces the new 650 V CoolSiC™ Hybrid IGBT single tube
2021-04
Passive Components
Infineon Technologies
[Apr 30 2021] Infineon Technologies AG introduces the CoolSiC™ Hybrid IGBT single tube with a 650 V turn-off voltage. The new CoolSiC Hybrid IGBT combines the key benefits of the 650 V TRENCHSTOP™ 5 IGBT and the CoolSiC™ Schottky Barrier diode with excellent switching frequency and lower switching losses, especially for DC-DC and power factor correction (PFC) applications. Common applications include: battery ...

Nexperia introduces a half-bridge automotive MOSFET with space-saving LFPAK56D package technology
2021-04
Semiconductors
Nexperia
[Apr 30 2021] Nexperia has announced a range of half-bridge (high-end and low-end) automotive MOSFETs featuring space-saving LFPAK56D package technology. A half-bridge configuration with two MOSFETs is a standard building block for many automotive applications, including motor drivers and DC/DC converters. This new package provides a single-device half-bridge solution. Compared to two-channel MOSFETs for three ...

STMicroelectronics has launched the STPay-Mobile mobile payment platform
2021-04
Power
STMicroelectronics
[Apr 29 2021] STMicroelectronics has launched STPay-Mobile, a mobile payment platform that simplifies the virtualization of bus and payment cards on smartphones and wearables and meets the stringent security standards for such applications. STPay-Mobile enables mobile device manufacturers to leverage the capabilities of ST's ST54 Security System-on-a-chip (SoC) to process contactless transactions and protect s ...

Vishay introduces a new AT precision automotive-grade film disc exclusion
2021-04
Passive Components
Vishay
[Apr 29 2021] Vishay Intertechnology has announced that its ACAS 0606 AT and ACAS 0612 AT precision automotion-grade film sheet rejection has been further enhanced, increasing the resistance ratio to 1:100 and operating voltage to 100 V. Vishay Beyschlag devices provide designers with greater flexibility to choose from a wider range of input voltages for divider applications or to achieve up to five times grea ...

Qualcomm Snapdragon X65/X62 two 5G basebands were released at the same time to facilitate the creation of diversified terminals
2021-04
Power
Qualcomm
[Apr 29 2021] Qualcomm's fourth-generation 5G baseband Snapdragon X65 was officially released, which can be called Qualcomm's biggest leap forward in 5G solutions. The Qualcomm Snapdragon X65 5G baseband is the world's first 10Gbps 5G speed support and the first 3GPP Release 16 compliant modem and RF system, designed to support the fastest 5G transmission speeds on the market with fiber-optic wireless performa ...