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TDK introduces ultra-small TVS diodes with high ESD protection
2021-06
Passive Components
TDK
[Jun 26 2021] TDK Corporation further expands its portfolio of bidirectional overvoltage protection components for I/O interfaces with the introduction of ultra-small, high-power TVS (Transient suppression) diodes for ESD protection applications. The new components are available in chip-scale packages of only 400 x 200µm²(CSP01005) or 600 x 300µm²(CSP0201), and the package height is also extremely low at 100µm ...

Flex Power module introduced small SIP package 80A digital PoL regulator
2021-06
Power
Flex Power Modules
[Jun 25 2021] Flex Power Modules now introduces the BMR474, a high power density, digital non-isolated point load (PoL) regulator. With a vertically mounted SIP (single-in-line package) design, the BMR474 saves valuable board space while being able to deliver up to 80A output current with a maximum power output of 198W. Designed for telecommunications and data communication applications, the BMR474 offers exce ...

Renesas DDR5 I3C bus extensions and SPD hub products are AMI firmware certified
2021-06
Connectors
Renesas Electronics America
[Jun 25 2021] Renesas Electronics announced that the Renesas I3C Bus extension product has been certified by partner AMI for MegaRAC® SP-X remote management software and firmware. With I3C products on the AMI Certified Vendor list, customers can easily migrate their DDR5 platforms and boards from I2C or other traditional extender specifications to the new high-speed I3C specifications. The IMX3102 2:1 bus mult ...

C&K launches ultra-thin touch switches for wearable devices
2021-06
Connectors
C&K
[Jun 24 2021] C&K, a leading manufacturer of high-quality electromechanical switches, has developed a micro SMT touch switch for wearable and portable iot devices. The PTS847 series of side-start touch switches not only save space, but also have improved durability to cope with the drop shocks that consumer equipment often experiences. The PTS847 series touch switches are only 4.6mm x 2.2mm x 2.6mm in size and ...

Advanced Energy introduces an ultra-small, high power density DC/DC power converter
2021-06
Power
Advanced Energy
[Jun 24 2021] Advanced Energy has been committed to developing a variety of advanced high-precision power conversion, measurement and control systems and other solutions, and this area of technology has been the world leader. The company announced the launch of a new ultra-small 48V input DC/DC power converter, which shows that the market leader in this line of power products continues to grow with more differ ...

Renesas has expanded its FemtoClock offering for high-performance communications and data centers
2021-06
Connectors
Renesas Electronics America
[Jun 23 2021] Renesas Electronics announced the expansion of Renesas Clock solutions with a new "point of use" clock solution with jitter below 100fs for data centers, servers and network infrastructure. The new FemtoClock2 product family includes ultra-low jitter clock generators and jitter attenuators in a small 4mm x 4mm package that allows for economical and simple clock tree configuration for a new genera ...

CISSOID introduces SiC intelligent power modules for aviation applications
2021-06
Power
Citizen
[Jun 23 2021] CISSOID, a leader in high-temperature semiconductor devices and power modules, announced the introduction of a three-phase silicon carbide (SiC) MOSFET Smart Power Module (IPM) based on a lightweight AlSiC Flat Baseplate. To meet the needs of natural air convection or backplane cooling in aviation and other special industrial applications. This high temperature chip and module technology platform ...

Dialog further enriches its IoT portfolio with the industry's lowest-power flash device
2021-06
Semiconductors
Dialog Semiconductor GmbH
[Jun 22 2021] Dialog Semiconductor, a leading provider of battery and power management, Wi-Fi, Bluetooth Low Energy (BLE), and industrial edge computing solutions, announced the introduction of the AT25EU family of SPI NOR Flash devices to support the development of power-focused, size-constrained connected devices. The AT25EU series is focused on achieving the lowest power consumption and the fastest operatin ...

TDK offers compact and rugged ultrasonic sensor modules for industrial applications
2021-06
Sensors
TDK
[Jun 22 2021] Distance measurement is playing an increasingly important role in the industrial field. The promotion of the concept of Industry 4.0 has further promoted the development of distance measurement applications, such as robotics in automation technology. To meet the high demands of harsh industrial environments, TDK has developed a compact and rugged ultrasonic sensor module. There are many range mea ...

Ams introduces new high-performance reading ics to drive cost savings and efficiency gains for medical and industrial digital X-ray equipment manufacturers
2021-06
Sensors
ams
[Jun 21 2021] Ams, a leading global provider of optical solutions, announced the introduction of the AS585xB family of best-in-class reading ics for digital X-ray flat panel detectors (FPD), which offers customers new flexible connector options and reduced cost of integration into their systems. ● The new AS585xB product is compatible with standard connectors in X-ray imaging equipment and easier to assemble; ...

Vishay introduces infrared sensor modules for outdoor use with extended temperature range
2021-06
Sensors
Vishay
[Jun 21 2021] Vishay Intertechnology has announced the addition of the TSSP77038 infrared (IR) sensor module in its HeimDall-packaged package, the TSSP77038ETR, with an extended temperature "E" option. The Vishay Semiconductors TSSP77038ETR extends the storage temperature to -40 C~+110 C and the operating temperature to -30 C~+85 C to meet the special requirements of outdoor applications. The storage temperatu ...

Teledyne LeCroy launches its range of high-definition oscilloscopes
2021-06
Power
Teledyne LeCroy
[Jun 20 2021] Teledyne LeCroy has introduced the latest addition to its range of high-definition oscilloscopes. The HDO6000B series provides a new solution to the unique problems facing today's analog, digital and mixed-signal designers. Industry trends such as the Internet of Things, embedded and mobile computing create unique constraints for design engineers. The system must provide more functionality and co ...