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Infineon Launches AIROC CYW20820 Bluetooth and Low Power Bluetooth System on Chip
2022-09
Semiconductors
Infineon Technologies
[Sep 3 2022] Infineon Technologies Co., Ltd. will launch AIROC CYW20820 Bluetooth and low-power Bluetooth System on Chip (SoC), further expanding its product portfolio of AIROC Bluetooth series. AIROC CYW20820 Bluetooth and low-power Bluetooth system on chip are specially designed for Internet of Things applications and comply with Bluetooth 5.2 core specifications. It can support rich application scenarios o ...

NXP launched a 4-channel dual polarization analog beam former
2022-09
Semiconductors
NXP
[Sep 3 2022] NXP Semiconductor added 4-channel dual polarized analog beam formers MMW9012K and MMW9014K, as well as an antenna system development kit, to the 5G product series. These two analog beam formers use NXP's SiGe technology to support dual polarization, which can improve the reliability of 5G millimeter wave solutions, improve integration, reduce the size of 5G base stations, reduce costs, and reduce ...

Rohm and Schwartz introduced a high performance directional finding and monitoring integrated antenna system for a single channel directional finder
2022-09
Semiconductors
Rohm Semiconductor
[Sep 3 2022] Rohm & Schwartz announces the launch of a new high-performance R&S ADD597 all-in-one antenna system for direction finding and monitoring. The system is a key component of fixed, mobile and portable spectrum monitoring stations. The R&S ADD597 combines the use of a single-channel direction finder to provide reliable measurements even in dense spectrum environments. The system provides high accurac ...

EC12 power input module expands product range
2022-09
Power
Schurter
[Sep 2 2022] The compact EC12 series power input module with snap in installation has the same integrated functions as the flange installation model: IEC C20 power input socket, high-performance single-stage filter and power switch (with or without indicator light). In addition, the series is equipped with a snap in arm to ensure a tight fit when installing the panel. The metal edges on the housing ensure goo ...

Bourns Introduces High Current Shielded Power Inductors
2022-09
Semiconductors
Bourns
[Sep 2 2022] Bourns introduced a new high current shielded power inductor. The five new power inductors are SRP2010TMA, SRP2012TMA, SRP2510TMA, SRP2512TMA and SRP3212A, which are miniature, 0.8 x1 mm small size designs, and all comply with AEC-Q200 standards. The five series adopt Bourns' advanced metal powder magnetic core and manufacturing process design, as well as the advantages of magnetic shielding stru ...

Vishay introduces a new AEC-Q200 standard thin DC Link film capacitor with high reliability and performance
2022-09
Semiconductors
Vishay
[Sep 2 2022] Vishay Intertechnology, Inc. announced the launch of a new series of thin DC Link metallized polypropylene film capacitors that meet AEC-Q200 standards - MKP1848Se DC Link. Vishay Roederstein MKP1848Se DC Link is an advanced device in the industry. Under the conditions of rated voltage, temperature of 60 ° C/relative humidity of 93%, it has undergone temperature humidity bias (THB) test for 56 da ...

NXP Launches New MCX Microcontroller Product Portfolio
2022-09
Semiconductors
NXP
[Sep 2 2022] NXP Semiconductors officially released a new MCX microcontroller product portfolio, aiming to promote innovation in smart homes, smart factories, smart cities, and many emerging industries and edge applications of the Internet of Things. The product portfolio consists of four series, which are built on a common platform and supported by widely used MCUXpresso development tools and software suites ...

Infineon Launches a New Generation of High Performance XENSIV MEMS Microphone
2022-09
Semiconductors
Infineon Technologies
[Sep 2 2022] Infineon Technology Co., Ltd. released a new generation of XENSIV MEMS microphone. New products include IM69D127, IM73A135 and IM72D128, which further expand Infineon's microphone product portfolio and set a new benchmark for the industry. These MEMS microphones with optional power modes are applicable to various consumer electronic products, such as headphones with active noise reduction (ANC) f ...

Infineon launched a highly integrated and flexible WLC wireless charging platform
2022-09
Semiconductors
Infineon Technologies
[Sep 1 2022] In the past few years, with the rapid development of the wireless charging market, more and more applications and wireless charging functions have made it advantageous for their own use. In order to help designers overcome the challenges posed by modern wireless charging and meet the requirements of key applications, Infineon Technology Co., Ltd. released the WLC1115 transmitter controller IC, th ...

Renesas Electronics released RZ/T2M motor control MPU to realize fast and high-precision control of servo motor
2022-09
Semiconductors
Renesas Electronics America Inc.
[Sep 1 2022] Renesas Electronics, a global semiconductor solution supplier, announced the launch of Rexa's high-performance RZ/T2M motor control microprocessor unit (MPU), which is used in AC servo drives, industrial robots and other fields. RZ/T2M combines fast, high-precision real-time motor control capability and support for the latest industrial Ethernet protocol on a single chip, while realizing function ...

Microchip introduces devices and ecosystems that conform to ISO 26262 and are ready for AUTOSAR, simplifying automobile design
2022-09
Semiconductors
Microchip Technology
[Sep 1 2022] With the development of the electric vehicle and autonomous vehicle market, original equipment manufacturers (OEMs) are faced with increasing application complexity and the demand for functional safety and reliable solutions that comply with AUTOSAR and ISO 26262. In order to support automotive developers to design scalable applications for the future technology and meet the requirements of the l ...

ST semiconductor high bandwidth common mode filter ensures gigabit serial port signal integrity
2022-09
Semiconductors
STMicroelectronics
[Sep 1 2022] The new common mode filter introduced by STC has a differential bandwidth up to 10.7GHz, which can prevent the new generation serial digital interface from affecting the antenna reception sensitivity of adjacent wireless circuits. The dual channel ECMF2-40A100N10 and the four channel ECMF4-40A100N10 are compatible with high-speed interface standards, including USB 3.2 Gen 2, USB4, HDMI 2.1 and Di ...