Technology Articles

2023-02 Power Interlink Electronics

[Feb 10 2023] Interplex has introduced new multirow board-to-board (BTB) connector products. The proprietary unit cookie design allows multiple connector units to be stacked on top of each other. This shows that interconnects can be appropriately sized without having to be customized for them. This unique, cost-effective approach will allow different pin count requirements to be met through the same basic inte ...

2023-02 Semiconductors Microchip Technology

[Feb 10 2023] Microchip Technology's PIC32CM LE00, LS00, and LS600 (PIC32CM Lx) ultra-low power microcontrollers. Offering 32-bit performance and ultra-low power consumption while offering memory configurations of up to 512KB flash memory and 64KB SRAM, the series offers three different product options for designers looking to address challenges in the Internet of Things, consumer, industrial and medical marke ...

2023-02 Semiconductors Illinois Capacitor

[Feb 10 2023] Innodisk has launched a new family of camera modules to further support the AI development of its image recognition technology. Compared to products on the market today, its new camera module has three major advantages: custom development, platform compatibility and ISP adaptation. At the same time, quality and longevity are ensured to the same high standard as all products and are provided with ...

2023-02 Semiconductors Infineon Technologies

[Feb 10 2023] Infineon Technologies has added the EasyPACK 4B to its industry-leading Easy power module line. The new series of guide lines are mainly used in photovoltaic series inverters. The application can achieve a power output of up to 352kW, a substantial increase of approximately 40% compared to the previous generation 250kW PV inverter using EasyPACK 3B. The module is designed to achieve a simpler but ...

2023-02 Semiconductors Infineon Technologies

[Feb 9 2023] EZ-PD CCG7DC is a highly integrated dual-port USB Type-C power transfer solution with integrated step-boost controllers. It is designed to be a perfect match for multi-port AC-DC charger/adapter and cigarette lighter adapter. Users get a high degree of programmability thanks to its 32-bit Arm Cortex-M0 processor on chip, 128 KB flash memory, 16 KB RAM, and 32 KB ROM. In addition, several analog a ...

2023-02 Sensors TDK

[Feb 9 2023] TDK introduces the new ACT1210E series (3.2 x 2.5 x 2.5 mm (L x W x H)) common mode filter for Automotive Ethernet 10BASE-T1S. Mass production of the new common-mode filter will begin in February 2023 ● The industry's first for automotive Ethernet 10BASE-T1S common mode filter ● Construction to reduce interline capacitance ● High reliability is achieved by laser welding the winding wire to the me ...

2023-02 Semiconductors TDK

[Feb 9 2023] TDK Corporation has introduced the new B43652 series of welded aluminum electrolytic capacitors. The new family of components features ultra-compact size and ultra-large ripple current-carrying capacity, and is Rohs-compliant, designed for a maximum voltage rating of 450 V DC and available in seven capacity ratings ranging from 270 μF to 820 μF. Capacitors ranging from 270μF to 560μF are availabl ...

2023-02 Power Qorvo US Inc.

[Feb 9 2023] Qorvo, a leading provider of RF solutions for mobile, infrastructure and aerospace and defense applications, announced the launch of a compact three-chip power solution for phased array radars. The three-chip solution provides configurable GaN offset point automatic calibration, enabling engineers to maximize system performance across different GaN power amplifiers (PA) without changing the board ...

2023-02 Semiconductors Diodes Incorporated

[Feb 9 2023] Diodes announced the release of the first silicon Carbide (SiC) Schottky Barrier diode (SBD). The product portfolio includes the DIODES DSCxxA065 series with eleven 650V rated products (4A, 6A, 8A, and 10A) and the DIODES DSCxx120 series with eight 1200V rated products (2A, 5A, and 10A). The benefits of these wide-gap SBDS include significantly improved efficiency and high temperature reliability ...

2023-02 Power ECS

[Feb 8 2023] EPC introduces the 80-V AEC-Q101-certified Gallium nitride Field effect Transistor (GaN FET) EPC2252 to provide designers with a smaller and more efficient solution than silicon MosFEts for vehicle scale lidar, 48 V/12 V DC/DC conversion and low-inductance motor drivers. As a global leader in enhanced gallium nitride (eGaN) FETs and ics, EPC Power Conversion Corporation (EPC) has further expanded ...

2023-02 Passive Components Silicon Labs

[Feb 8 2023] Silicon Labs BG24 and MG24 Series 2 wireless System on Chip (SoC) devices. The product family is a 2.4GHz RF enabled low power wireless SoC with AI/ML hardware accelerators, providing the ideal solution for mesh Internet of Things (IoT) wireless connectivity using Matter, OpenThread and Zigbee protocols. These new wireless SoCs support a variety of smart home, lighting and building automation app ...

2023-02 Semiconductors Toshiba Semiconductor and Storage

[Feb 8 2023] Electronic Components and Memory Devices Corporation (" Toshiba ") announced the launch of two smart power devices - "TPD2015FN" and "TPD2017FN" - for controlling the drive of inductive loads used in motors, solenos, lamps and other applications such as programmable logic controllers for industrial equipment. High side switch (8 channels) "TPD2015FN" and low side switch (8 channels) "TPD2017FN" T ...