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Toshiba launched five new MOSFET grid drive ICs to help miniaturize mobile electronic equipment

Sep 1 2022 2022-09 Semiconductors Toshiba Semiconductor and Storage
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Toshiba Electronic Components and Memory Devices has announced the addition of five new products to its TCK42xG line of MOSFET gate drive ics for mobile electronic devices such as wearables. The new products in this line are equipped with an overvoltage locking feature that controls the gate voltage of an external MOSFET based on the input voltage.

     Toshiba Electronic Components and Storage Devices Co., Ltd. announced that five new products applicable to mobile electronic devices such as wearable devices have been added to its TCK42xG series MOSFET gate drive IC products. The new products of this series are equipped with overvoltage locking function, which can control the gate voltage of external MOSFETs according to the input voltage.

 

     The new products specifically include: "TCK420G" for 24V power cord; "TCK422G" and "TCK423G" for 12V power cord; "TCK424G" for 9V power cord; And "TCK425G" for 5V power cord. It forms a complete product line with the "TCK421G" that has been launched for 20V power cord.

 
     After the introduction of these five new products, TCK42xG series now allows users to choose between 10V and 5.6V gate source voltages, which cover more MOSFETs. With the multiple detection voltages of the input overvoltage locking function, the product can be used for 5V to 24V power lines. If used in combination with external back-to-back MOSFETs, they are also suitable for configuring load switching or power multiplexer circuits with reverse current blocking functions. In addition, its built-in charge pump circuit supports a wide input voltage range from 2.7V to 28V. Therefore, after intermittent operation, it can provide a stable voltage between the gate and source of external back-to-back MOSFETs - this way allows switching of large currents.


     TCK42xG is packaged with WCSP6G, which is one of the smallest packaging types in the industry. It helps small devices such as wearables and smartphones achieve high-density mounting, thereby reducing their

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