The world's first 176-layer NAND mobile solution to power the 5G ultra-fast experience

     Micron Technology announced that it has begun volume shipping of the world's first universal flash UFS 3.1 mobile solution based on 176-layer NAND technology. Tailored for high-end flagship phones, the product delivers up to 75% sequential write and random read performance improvements over its predecessor , unlocking 5G potential - a two-hour 4K movie can be downloaded in just 9.6 seconds .

     The compact size of Micron's 176-layer NAND is the perfect fit for the large capacity and small size of mobile devices. Previously, Micron announced in June that it had shipped PCIe 4.0 SSDS with 176 layers of NAND, providing a flexible design option with high performance and low power consumption for professional workstations and ultra-thin notebooks. Today, Micron has successfully applied the industry's first cutting-edge NAND technology and performance to smartphones, resulting in a faster phone response experience and true multitasking between applications.

     Raj Talluri, senior vice president and general manager of Micron's Mobile Products group, said: "5G communication technology can increase the transmission rate of mobile devices to the level of several gigabytes, but this ultra-fast mobile experience must have a high-performance hardware foundation. "Micron's 176-layer NAND delivers a technological breakthrough that delivers unmatched performance for smartphones, enabling consumers to quickly and easily experience rich multimedia content on their mobile devices."

     Micron's 176-layer UFS 3.1 solution delivers a 15 percent increase in hybrid workload performance over the previous generation, enabling phones to launch and switch applications faster for a smoother mobile experience. Micron applied 176-layer NAND technology to UFS 3.1 to overcome storage bottlenecks and enable mobile phone users to enjoy 5G high-speed communications.

     Fang Fei, product line President of Honor Terminal Co., LTD., said: "The Honor all-purpose flagship Magic3 series will be the first to be equipped with UFS 3.1, the industry's first 176-layer NAND technology launched by Micron. This high-performance 3D NAND solution will provide Honor mobile phone users with a fast and smooth experience in the use of multiple applications at the same time, as well as high-speed download and storage."