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Texas Instruments' TPSM63606 High Density 6 A Power Module

Apr 6 2022 2022-04 Power Texas Instruments
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Texas Instruments TPSM63606 is A highly integrated 6 A, DC/DC synchronous step-down power supply module that combines power MOSFETs, shielded inductors, and passive devices in an enhanced HotRod QFN package. The module's VIN and VOUT pins are located in the corner of the package to optimize the input and output capacitor layout

     Texas Instruments' TPSM63606 is a highly integrated 6 A, DC/DC synchronous step-down power module that combines power MOSFETs, shielded inductors, and passives in an enhanced HotRod QFN package. The module's VIN and VOUT pins are located at the corners of the package to optimize input and output capacitor placement. There are four larger thermal pads under the module for simple layout and easy handling during manufacturing. With an output voltage range of 1 V to 16 V,

     The TPSM63606 is designed to quickly and easily implement low EMI designs in small PCB footprints. The entire solution requires only four external components and eliminates the choice of magnetics and compensation components during the design process.

     Although the TPSM63606 module is small in size and simple in design, designed for space-constrained applications, it offers many features for robust performance, including precision enable with thermal hysteresis for adjustable input voltage UVLO, resistor adjustable Programmable switching node slew rate and spread spectrum options for improved EMI. Integrated VCC, bootstrap and input capacitors provide higher reliability and higher density, provide constant switching frequency over the entire load current range, and use PGOOD indicator for sequencing, fault protection and output voltage monitoring.

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