TI Introduces New 3D Hall Effect Position Sensor, Combining High Speed and High Accuracy for Faster Real-Time Control

     Texas Instruments introduces TI's accurate 3D Hall-effect position sensor. With the TMAG5170, engineers can achieve ultra-high accuracy without calibration at speeds up to 20 kSPS, enabling faster and more precise real-time control in factory automation and motor drive applications. The sensor also offers integrated functional and diagnostic features to maximize design flexibility and system safety while consuming at least 70 percent less power than competing devices. The TMAG5170 is the first device in TI's new family of 3D Hall-effect position sensors addressing a wide range of industrial needs, including ultra-high performance and general purpose applications

     "Smart factories have an increasing number of highly automated systems that must operate in more integrated manufacturing processes while simultaneously collecting data to control the process," said Noman Akhtar, senior research analyst at Omdia. "3D position-sensing technology with higher accuracy, speed and energy efficiency is critical for automated equipment, which can rapidly enable precise real-time control to improve system efficiency and performance while reducing downtime."

     The TMAG5170 requires no off-chip computation and enables flexible orientation of sensors and magnets through integrated features such as an angle calculation engine, average measurement, and gain and offset compensation. These features simplify design and maximize system flexibility, enabling faster control loops, reducing system latency, and simplifying software development regardless of sensor placement. The sensor's integrated computing capabilities also reduce the system's processor load by up to 25 percent, enabling engineers to use general-purpose MCUs such as TI's low-power MSP430™ MCUs to minimize overall system cost.

     In addition, the TMAG5170 enhances safety with a unique set of smart diagnostics such as checking communications, continuity and internal signal paths, as well as diagnostics configurable for external power, magnetic fields and system temperature. As a result, engineers can customize chip- and system-level security solutions for long-term reliability and lower design costs.