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TE Connectivity introduces compact force sensors

Jul 5 2020 2020-07 Sensors TE Connectivity
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TE Connectivity (TE) optimizes compact force sensor designs to improve performance. The most fundamental characteristics of force sensors are sensitivity, stability, repeatability and accuracy. In addition, it is important that the force sensor should also be able to withstand high overloads (including unexpected drops and other unforeseen pressures) without damage during normal use and operation.

     TE Connectivity (TE), a global leader in connectivity and sensing, optimizes the design of compact force sensors to improve performance. The most fundamental characteristics of force sensors are sensitivity, stability, repeatability and accuracy. In addition, it is important that the force sensor should also be able to withstand high overloads (including unexpected drops and other unforeseen pressures) without damage during normal use and operation. With the exception of metrology applications where sensor accuracy, stability and repeatability are the main factors alone, most applications in the device manufacturer and consumer market need to consider the balance of execution of force sensor functions with production costs and the ability to scale up to mass production thresholds.

 

     TE Connectivity's (TE) FX29 push-button compression force sensor is an example of high performance and outstanding value, while being designed to be extremely compact. The core sensing element is a semiconductor micromechanical silicon piezoresistive strain gauge. Each force sensor has four carefully arranged MEMS bare chips, and these strain gauges are paired according to closely matched thermal/electrical operating characteristics to form a Wheatstone bridge, with two strain gauges measuring tension and two others measuring compression forces, and the substrate to which the strain gauges are attached can deform when subjected to external forces or torque. The differential voltage output signal generated by the bridge is proportional to the amount of external force applied to the FX29 substrate.

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