TDK's µPOL technology improves electrical and thermal performance

     TDK's FS1412 ultra-thin microPOL (µPOL) DC/DC converter in a small 5.8 mm x 4.9 mm x 1.6 mm package offers higher performance, ease of use and easier integration for big data, machine learning, artificial intelligence Applications such as intelligence (AI), 5G cellular, IoT networks, telecom and computing enterprises. µPOL technology consists of a DC/DC converter placed near complex chipsets such as ASICs, FPGAs, etc. Minimizing the distance between the converter and the chipset minimizes resistive and inductive components, enabling fast response and precise regulation of dynamic load currents.

     TDK developed this technology to enable system-level solutions with enhanced electrical and thermal performance, aiming to provide cost-effective, high-density solutions for space-constrained applications requiring small form factor power supplies. These solutions incorporate high-performance semiconductors into advanced packaging technologies, such as semiconductor embedded in substrates (SESUB) and advanced electronic components, to enable smaller and thinner unique system integration through 3D integration. This integration enables TDK to provide high efficiency and ease of use at a lower total system cost.

     The µPOL DC/DC converter family operates over a wide junction temperature range (-40°C to +125°C) and features high current densities in excess of 1000 A per cubic inch. The series provides 12 A output current in a low commercial height of 1.6 mm, minimizing system solution cost, board size and assembly cost as well as BOM and PCB cost