TDK launches high-precision chip NTC thermistor that can be embedded in IGBT modules

     TDK Group is proud to introduce the new chip L860 NTC thermistor. It can be embedded directly into the power module, supports sintered and heavy-duty aluminum wire bond connections, and has characteristics that match the common MELF-R/T curve at R100 = 493 Ω. The new lead-free component is order number B57860L0522J500, has an operating temperature range of -55 °C to +175 °C, and measures 1.6 x 1.6 x 0.5 mm.

     Unlike traditional chip mount (SMD) NTC thermistors, the new components are leadless and support horizontal mounting. In terms of connection, the Ni/Ag thin film electrode at the bottom can be sintered to the DCB (Direct Copper Bonding) substrate of the power module, while the Ni/Au thin film electrode on the top supports aluminum wire bonding without soldering process.

     The L860 is ideal for integration into IGBT modules and IPM modules. Compared to other technologies, this solution achieves stable thermal coupling between the chip NTC thermistor and the power module, enabling ultra-fast response, and high-precision temperature measurement and control. Power modules are typically most efficient when operating near their power limit, but to maintain limit state operation, temperature must be precisely controlled. The typical operating temperature of the new components is in the range of 100 °C, with a slight increase to 175 °C.