TDK introduces a new stray-field compensated 3D HAL sensor with redundancy and a digital output interface

     TDK has expanded its Micronas 3D HAL sensor portfolio with the new Hall sensors HAR 3900 and HAR 3930*. These products support stray field compensation position detection in automotive and industrial applications while meeting ISO 26262 compliant development requirements.

     According to ISO 26262, the sensor supports SEooC and ASIL B for system-level development of ASIL D. They can perform 3D magnetic field measurement and 2D stray field robust position detection. The HAR 3930 has PWM and SENT (SAE J2716 Revision 4) outputs, additional switching outputs, and the HAR 3900 provides usable measurement data via a high-speed SPI interface. Both sensors are dual-chip SMD packaged versions of HAL 3900 and HAL 3930 and are suitable for a variety of applications, including steering Angle position detection, transmission position detection, shift position detection, accelerator and brake pedal position detection. 

     The HAR 39xy sensor uses a ferrite bipolar magnet for Angle measurements up to 360°, as well as a bipolar bar magnet for linear measurements up to 35 mm. There are two measurement types for stray field robust position detection, and additional 3D measurements produce two independent angles for each chip. The HAR 3900 provides temperature compensation raw values for X, Y, and Z magnetic fields via the SPI interface, along with a variety of low power modes. The patented 3D HAL pixel unit technology that accurately measures magnetic fields is at the heart of the HAR 39xy sensor.

     The flexible architecture of the HAR 39xy enables multiple configuration options, enabling design engineers to choose the best operating mode for any given task. It has a powerful DSP for fast signal processing and an embedded microcontroller with executable interface configurations, while overseeing the performance of functional safety-related tasks.

     Each HAR 39xy sensor consists of two overlapping independent chips that are mechanically separated and electrically insulated. The two chips measure nearly the same magnetic field, thus ensuring a synchronized output signal. The advantages of a redundant sensor solution in a single package are reduced PCB size and reduced solder joints, which reduces system cost and enhances system stability. The HAR 3900 and HAR 3930 are packaged in a small SSOP16 package.