TDK introduces a demo kit of ultrasonic sensor modules that detect obstacles

     TDK Corporation is pleased to introduce the demo kit for the mechanically decoupled ultrasonic sensor module USSM1.0 PLUS-FS. It is ideal for obstacle detection and distance measurement applications under harsh conditions, such as bright light and transparent object detection, and is widely used in autonomous mobile robots (AMR) or autonomous guided vehicles (AGV).

     The demo kit includes a TDK demo board, USB-A to Micro-B cable, two ultrasonic sensor modules, two sensor cables, and two seals. The software package allows users to monitor sensor performance in a variety of operating modes and provides digital IO and analog readings of echo tracks. The presentation board visualizes what sensors can detect and how they react in specific situations, helping users simplify early and later stages of development.

     The USSM1.0 PLUS-FS demonstration kit has an IP65/67 protection rating to prevent distortion of measurement results due to external mechanical vibration. It is driven by a driver and integrated piezoelectric disk, and is equipped with an integrated signal processor ASIC, which can calculate signal propagation time at a repetition rate of up to 50 samples per second. In this way, its measuring distance ranges from 18 cm to 200 cm; The measurement distance can be as short as 4 cm in a one-shot mode through multiple modules.