TDK Introduces New Stray-Field Compensated 3D HAL Sensor With Redundancy and Digital Output Interface

     TDK Corporation has expanded the Micronas 3D HAL sensor portfolio with the new Hall sensors HAR 3900 and HAR 3930. These products support stray field compensated position detection in automotive and industrial applications while meeting ISO 26262 compliant development needs. Samples are available upon request.

     The sensor supports SEooC and ASIL B according to ISO 26262, enabling system-level development for ASIL D. They perform 3D magnetic field measurements, 2D stray field robust position detection; the HAR 3930 has PWM and SENT (SAE J2716 revision 4) outputs, additional switching outputs, and the HAR 3900 provides available measurement data via a high-speed SPI interface. Both sensors are two-chip SMD package versions of the HAL 3900 and HAL 3930, suitable for a variety of applications including steering angle position detection, transmission position detection, shifter position detection, accelerator and brake pedal position detection.

     The HAR 39xy sensor uses ferrite bipolar magnets for angular measurements up to 360°, while also using bipolar bar magnets for linear measurements up to 35 mm. There are two measurement types for stray field robust position detection, and the additional 3D measurement results in two independent angles for each chip. The HAR 3900 provides temperature-compensated raw values of magnetic fields in the X, Y, and Z directions via the SPI interface, while offering various low-power modes. Patented 3D HAL pixel cell technology that accurately measures magnetic fields is at the heart of the HAR 39xy sensor.

     The HAR 39xy's flexible architecture enables multiple configuration options, allowing design engineers to select the best operating mode for a variety of given tasks. It has a powerful DSP for fast signal processing and an embedded microcontroller for interface configuration while overseeing the execution of functional safety-related tasks.

     Each HAR 39xy sensor consists of two separate chips that overlap each other, which are mechanically separated and electrically isolated. Both chips measure nearly the same magnetic field, ensuring synchronized output signals. The advantages of a single-package redundant sensor solution are reduced PCB size and fewer solder joints, thereby reducing system cost and enhancing system stability. The HAR 3900 and HAR 3930 are available in a small SSOP16 package.