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TDK Develops Industry's First High-Reliability Chip Beads for Automotive

May 30 2022 2022-05 Semiconductors TDK
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TDK Corporation has developed the MMZ1608-HE series of high-reliability chip beads for automobiles and has started mass production, which supports high-durability soldering at 150°C. The electroplating process improves the bond strength between the terminal electrode and the electroplating, making it ideal for high-durability soldering at 150°C.

     TDK Corporation has developed the MMZ1608-HE series of high-reliability chip beads for automobiles and has started mass production, which supports high-durability soldering at 150°C. This series of products is the industry's first highest reliability SMD magnetic beads designed for automotive related applications such as Engine Control Module (ECM), Anti-lock Braking System (ABS), Electric Power Steering (EPS), Electric and hybrid vehicles (EV/EHV), inverters and LED headlights, etc.

     In high-temperature automotive environments such as the engine compartment, high-durability soldering is increasingly being used to prevent solder cracks between chip assemblies and mounting substrates. Since high-durability soldering is not easy to stretch and exerts higher stress than traditional soldering, high-durability soldering imposes a large load on chip components and cannot meet the reliability requirements of existing chip beads. The MMZ1608-HE series products improve the bonding strength between the terminal electrode and the electroplating by improving the terminal electrode material and electroplating process, making it ideal for high-durability soldering at 150°C.

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