ST Unveils Matching Filters for STM32WL33 Wireless MCUs

Jul 4 2025 2025-07 Semiconductors STMicroelectronics st stdes-wl3xxxx stm32wl33

As IoT devices continue to shrink in size and grow in complexity, developers face mounting challenges when integrating reliable wireless connectivity into compact designs. In response, STMicroelectronics has introduced a series of highly integrated antenna matching ICs designed specifically to work with its STM32WL33 wireless microcontrollers (MCUs), streamlining RF development for applications like smart metering, remote monitoring, and industrial IoT.

At the heart of this launch is ST’s proprietary Integrated Passive Device (IPD) technology, which combines impedance matching and harmonic filtering in a single component built on a non-conductive glass substrate. The new components—MLPF-WL-01D3, 02D3, and 04D3—are designed to optimize RF performance while reducing the need for discrete passive components. With ultra-compact chip-scale packaging (CSPG), these antenna matching chips occupy minimal PCB real estate—just 1.47mm x 1.87mm in footprint and only 630µm in height after reflow soldering.

One of the key advantages of the new matching ICs is their built-in antenna protection function, which simplifies the RF path between the antenna and the STM32WL33 MCU. This not only improves signal integrity and reliability but also helps lower the overall BOM cost and reduces design complexity. For developers, this means fewer components, faster development cycles, and a higher likelihood of getting the RF design right the first time.

STMicroelectronics is offering seven variants of these matching chips, giving developers flexibility depending on application needs. Options are available for either low-frequency (413–479MHz) or high-frequency (826–958MHz) bands, for high-power (16dBm/20dBm) or low-power (10dBm) designs, and for two-layer or four-layer PCBs. This tailored approach allows for fine-tuned performance across a broad spectrum of IoT and industrial applications.

The STM32WL33 wireless MCU itself is based on an Arm® Cortex®-M0+ core and features a Sub-GHz RF transceiver operating in license-free frequency bands. With maximum output power reaching 20dBm, these MCUs are well-suited for long-range communications in smart cities, agriculture, and asset tracking scenarios. The integration of on-chip peripherals further simplifies system design, making them ideal for space- and cost-constrained deployments.

To help accelerate product development, ST also offers pre-certified and optimized RF reference designs (such as STDES-WL3xxxx) for the STM32WL33 platform, reducing the time and risk associated with wireless certification.

Now in mass production, the MLPF-WL-0xD3 series brings a practical solution to a long-standing challenge in wireless design: achieving reliable RF performance without the complexity of custom impedance matching networks. As IoT developers look to shorten time to market and build smarter, more efficient connected devices, this series of antenna matching ICs stands out as a key enabler for next-generation IoT design.

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