RECOM introduces the RPX-4.0 series of step-down converters in a cost-effective QFN package

     RECOM announced the launch of the RPX-4.0 series of step-down converters in a cost-effective QFN package. The RPX-4.0 is highly efficient, with temperatures up to 65°C at full power and 90°C at derated operation. The module uses RECOM's 3D power package technology to achieve its high power density, a flip-chip structure on the lead frame, an integrated shielding inductor to reduce EMI, and intelligent switching frequency control to maintain high efficiency even at light loads.

     RECOM has added the 4A option to the RPX series of micro buck converters. The RPX-4.0 has a rated input voltage of 3.8 to 36V and a programmable output voltage of 1 to 7V at 4A. The module comes in a heat-enhanced QFN package with a 5mm x 5.5mm x 4.1mm miniature package size, which pushes the power density limits of this step-down module. The product has on/off control, good power signal and soft start functions, and has complete undervoltage, short circuit, overcurrent and overheat protection.

     The RPX-4.0 is highly efficient, with temperatures up to 65°C at full power and 90°C at derated operation. The module uses RECOM's 3D power package technology to achieve its high power density, a flip-chip structure on the lead frame, an integrated shielding inductor to reduce EMI, and intelligent switching frequency control to maintain high efficiency even at light loads.

     The RPX-4.0 is a complete high-performance solution with only voltage setting resistors and input/output capacitors, and comes with a 3-year quality guarantee. RECOM also offers the evaluation board RPX-4.0-EVM-1, which allows customers to test all product functions and optimize filtration to meet the requirements of system applications.

     Matthew Dauterive, RECOM DC/DC Product Manager, said: "We are excited to introduce the latest RPX series of step-down converters. Users will find it particularly suitable for industrial automation, test and measurement, portable devices, and applications with high power density or weight sensitivity."