PI Introduces HiperLCS-2 Chipset, Improves LLC Converter Efficiency and Reduces Component Count by 40%

     Power Integrations announces the energy-efficient HiperLCS™-2 chipset, a new IC product family that greatly simplifies the design and production of LLC resonant power converters. The new dual-chip solution consists of an isolation device and an independent half-bridge power device. The isolation device integrates a high-bandwidth LLC controller, synchronous rectifier driver and FluxLink™ isolated control link. The stand-alone half-bridge power device uses Power Integrations' unique 600V FREDFET with lossless current sensing and integrated upper and lower transistor drivers. Both devices are available in an ultra-thin InSOP™-24 package. This highly integrated and efficient architecture eliminates the need for heat sinks and reduces component count by up to 40% compared to discrete designs.

     Edward Ong, senior product marketing manager at Power Integrations, said: “Resonant converters that use separate controllers and discrete MOSFETs can make power supplies too bulky. It’s notoriously difficult to manufacture power supplies due to their complexity and the use of more components. Even bigger difficulties. We applied advanced FREDFET and magnetically coupled FluxLink technology to LLC topology, resulting in 98% efficiency, 40% reduction in component count, and no need for space-consuming heat sinks and unreliable light With our solutions, design engineers can design small form factor adapters and open frame application power supplies for TVs, monitors with USB PD ports, all-in-one PCs, and game consoles, as well as power tools and small battery chargers for electric bicycles.”

     Resonant converters are often used in applications where efficiency cannot be achieved with traditional single-switch topologies such as flyback converters. The HiperLCS-2 chipset utilizes Power Integrations' high-speed FluxLink feedback mechanism to reduce design constraints associated with LLC topologies, enabling designers to quickly and efficiently complete high-performance, wide operating ranges and low component count designs.

     The power supply design based on the HiperLCS-2 chipset can achieve no-load input power of less than 50mW at 400VDC input, and provide continuous high-precision output, easily meeting the world's most stringent no-load and standby efficiency standards. The HiperLCS-2 device can maintain constant high-efficiency performance over the entire load range, and its extremely low self-power consumption only requires direct heat dissipation from the FR4 PCB. No heat sink is required in the adapter design with 220W continuous output power and 170% peak power capability. All HiperLCS-2 family devices feature self-powered start-up and also provide start-up bias power for PFC power stages implemented using the company's HiperPFS™ ICs. The secondary-side sensing method ensures less than 1% adjustment accuracy at different input voltages, over the entire load range, and in mass production. Compared to traditional optocouplers, Power Integrations' FluxLink technology is used for safety isolation, and its high-speed digital feedback control provides faster dynamic response characteristics and excellent long-term reliability.