
ON Semiconductor introduces new, integrated, converter-inverter-power factor correction (PFC) modules for motors that drive fans and pumps in industrial motor drives, servo drives and heating, ventilation and air conditioning (HVAC) applications.
The new NXH50M65L4C2SG and NXH50M65L4C2ESG are die casting mold power integration modules (TMPIM) based on standard alumina (AI2O3) substrates and enhanced low thermal resistance substrates, respectively. Ideal for rugged industrial applications with high output power, these modules contain A converter-inverter-PFC circuit consisting of a single phase converter integrated with four 75 A, 1600 V rectifiers. The three-phase inverter uses six integrated reverse diode 50 A, 600 V IGBTs, and the dual-channel interlaced PFC includes two integrated reverse diode 75 A, 650 V PFC IGBTs, and two 50 A, 650 V PFC diodes. A negative temperature coefficient (NTC) thermistor is embedded in the die casting power integration module to monitor device temperature during operation.
Since the module is pre-packaged in an optimized layout and configuration, parasitic elements are very small compared to PCB-based discrete designs, enabling a wide PFC switching frequency range between 18 kHz and 65 kHz. The energy-efficient NXH50M65L4C2SG and NXH50M65L4C2ESG, rated at 50 A and capable of being used in applications up to 8 kW, are the latest in ON Semiconductor's TMPIM family. Other devices are rated for 20 A and 30 A.
The compact die-cast DIP-26 package measures only 73 mm x 47 mm x 8 mm - 20 percent less area than current solutions, enabling higher power density levels. The sealed and robust package includes an integrated heat sink (6 mm from the pin) and provides a high level of corrosion resistance.
The new NXH50M65L4C2SG and NXH50M65L4C2ESG are equipped with the FAN9672 PFC controller and gate driver solution, including the new NCD5700x family of devices. The recently introduced NCD57252 dual-channel isolated IGBT/MOSFET gate driver offers 5 kV electrical isolation and can be configured for dual-down bridge, dual-up bridge or half-bridge operation. The NCD57252 comes in a small SOIC-16 widebody package and accepts logic level inputs (3.3V, 5V and 15V). The high-current device (source current 4.0A/perfusion current 6.0A at Miller platform voltage) is suitable for high-speed operation, as the typical propagation delay is 60 ns.
Driving the motor in the most energy efficient way is key to simplifying installation, reducing heat buildup, improving reliability, and reducing system costs. TMPIM devices from On Semiconductor standardize output pins to minimize parasitic elements and provide designers with a high-performance "plug and play" solution. Combining the NXH50M65L4C2SG and NXH50M65L4C2ESG with the FAN9672 and NCD57252 provides a fast design path for precision and energy efficient motor control schemes.
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