Nexperia surface mount devices meet board level reliability requirements for automotive applications

     Nexperia has announced that its surface-mount device, the copper clip-on FlatPower Package CFP15B, has for the first time passed a leading Tier 1 supplier's Board level reliability (BLR) test for automotive applications. The package will first be applied to the engine control unit.

     BLR is a method for evaluating the robustness and reliability of semiconductor packages. The tests follow extremely strict procedures and are important guidelines in automotive applications where safety and reliability are very important. As the automotive industry transitions to electric and connected vehicles, in-vehicle electronic systems are becoming more complex, so this certification is critical.

     Guido Sohrn, Product Manager for bipolar power discrete Devices at Nexperia, said: "Achieving BLR certification is a major breakthrough. The CFP15B represents a new generation of thermally enhanced ultra-thin surface mount devices. Feature-rich, reliable and durable, it is ideal for automotive components such as engine control units, transmission control units and many other safety applications such as braking."

     BLR verification confirms that the CFP15B's reliability performance level is more than twice the expected performance of the AEC-Q101. The power temperature cycle qualification combined with temperature cycle and intermittent operating life test, the equipment can reach 2600 cycles. "The application of surface mount devices in the automotive industry requires some harsh operating environments, and the CFP15B has proven its excellent performance in harsh conditions." Guido Sohrn added.

     The CFP15B is made of high-quality materials with zero delamination in terms of pins, chips and clips to prevent moisture from entering, thereby increasing reliability.

     CFP15B uses solid copper clips to reduce thermal resistance, improve PCB heat transfer, and make PCB design more compact. Compared to DPAK and SMx packages, the device is 60% smaller, but the thermal performance is no less. The smaller size saves a lot of space and allows for greater design flexibility.

     Device packages can be used for different power diode technologies, such as Nexperia's Schottky or fast recovery rectifier diodes, but can also be extended to silicon germanide power diodes or bipolar transistors. This significantly promotes product diversity, covering single/dual configurations and the 4-20A range, simplifying board design.