Nexperia's portfolio of 50µA Zener diodes extends battery life and saves PCB space

     Nexperia, a specialist in high-volume production of basic semiconductor components, announces a full line of low-current regulator diodes. The 50µA Zener Diode family offers 3 different surface mount (SMD) package options in an ultra-small discrete Flat No-Lead (DFN) package as well as AEC-Q101 qualified devices, providing customers with more choice and flexibility sex. These high efficiency diodes feature performance at low test current (50µA) and are ideal for low bias current and portable battery powered devices in mobile, wearable, automotive and industrial applications.

     Paula Stümer, Product Manager at Nexperia, said: "The DFN1006BD-2 package has wet-tin solderable side-to-side wettable pads (SWF), which solve many problems in size, performance and tolerance, and have a wide range of applications. A broad portfolio of 50μA Zener diodes in DFN technology is available, supporting a wide voltage range from 1.8V to 75V. These devices are also available in leaded SMD packages for customer flexibility.”

     With 40 new types of each package option, with nominal operating voltages ranging from 1.8V to 75V, the family is available in SOT23 (BZX8450), SOD323 (BZX38450), and SOD523 (BZX58550) ultra-thin surface-mount packages, as well as leadless DFN1006BD-2 (BZX8850S) package. Zener diodes have non-repetitive reverse peak power dissipation ≤40 W, total power dissipation ≤300 mW, and low dynamic resistance. Zener diodes are also available as part of the Q portfolio, qualified to AEC-Q101 and ISO/TS16949 automotive quality standards. More and more non-automotive applications require additional quality-related services, such as PPAP (Production Part Approval Process) and longer supply schedules, and the Q portfolio devices described above are able to meet these needs.

     DFN's compact package size (1.0 mm x 0.6 mm x 0.47 mm) is ideal for replacing large leaded packages on PCBs, saving up to 60% space. The device is equipped with side wettable solder pads (SWF) that can be wet-tinned to ensure that the solder flows along the sides of the chip when soldering on the PCB. The technology supports automatic optical inspection (AOI), ensuring that the high safety and reliability quality requirements of the automotive industry are met. DFN packaged Zener diodes have higher P(tot) values and lower operating temperatures than leaded devices, thereby improving system reliability.