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Nexperia introduces the world's smallest and thinnest 14, 16, 20 and 24-pin packages for standard logic devices

Aug 16 2021 2021-08 Passive Components Nexperia
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Nexperia has announced the world's smallest and thinnest 14, 16, 20 and 24-pin packages for standard logic devices. For example, the 16-pin DHXQFN package is 45% smaller than the industry-standard DQFN16 pin-free device. The new package not only has a smaller pin size than competing products, but also saves 25% of the PCB area.

     Nexperia has announced the world's smallest and thinnest 14, 16, 20 and 24-pin packages for standard logic devices. For example, the 16-pin DHXQFN package is 45% smaller than the industry-standard DQFN16 pin-free device. The new package not only has a smaller pin size than competing products, but also saves 25% of the PCB area.

 

     With package sizes of only 2 mm x 2 mm (14 pins), 2 mm x 2.4 mm (16 pins), 2 mm x 3.2 mm (20 pins) and 2 mm x 4 mm (24 pins), the 0.4mm pitch DHXQFN package is only 0.45 mm high. The device includes: sixteen inverters Schmidt flip-flop; 8-bit SIPO shift register with output latch; 4-bit dual power conversion transceiver; Eight-way buffer/line driver; Eight-bus transceiver; And 8-bit dual power conversion transceiver.

 

     Ashish Jha, Nexperia Product Manager, said: "Nexperia has a long history of more than 50 years in the development of standard logic devices, and we expect to become a recognized industry leader in the next three years. These new packages are an example of the innovation we bring. Before that, it would have been inconceivable to integrate a large number of logic functions into a small scale system. However, our new DHXQFN package packs complex features such as the 74HC595 shift register into space-sensitive applications such as smartwatches, mobile devices, and Internet-connected industrial devices."

 

     In addition, the small pin size of the DHXQFN package allows the device to be closer to the bypass capacity. This can be a major advantage for designs with limited space on the glued logic device board, and the short path between the logic device and the capacitor improves performance in high-frequency applications.

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