Microchip to Provide SiC MOSFETs and Digital Gate Drivers for Mersen SiC Power Stack Reference Design

     Electric mobility and renewable energy systems require power management solutions that increase performance efficiency and accelerate development time. To meet these requirements, Microchip Technology Inc announced a 150 kilovolt-ampere (kVA) three-phase silicon carbide power stack reference design in partnership with Mersen. Mersen is a global supplier of power management solutions to a wide range of industrial sectors including e-mobility and energy storage.

     Mersen's three-phase SiC power stack reference design provides system designers with a complete, compact high-power SiC solution that eliminates the need for separate device procurement, testing and qualification. The power stack reference design includes Microchip's silicon carbide power modules and digital gate drivers and Mersen's busbars, fuses, capacitors and thermal management, optimized in a single high-performance stack reference design. With Microchip's 1200V MSCSM120AM042CD3AG SiC MOSFET and AgileSwitch 2ASC-12A1HP digital gate driver, the power stack reference design enables engineers to rapidly develop high-voltage systems using a toolkit pre-designed for their application, reducing time-to-market by up to six moon.

     "Microchip's customers will benefit from partnering with Mersen to provide silicon carbide MOSFET and digital gate driver solutions," said Leon Gross, vice president of Microchip's discrete business unit. "Power inverter designers can Avoiding the procurement of separate components and reducing risk through reliability helps avoid downtime. Designers now have an all-in-one evaluation system.”

     The power stack reference design offers a power density of 16 kilowatts per liter (kW/l) and Tj up to 130°C, peak efficiency of 98%, and switching frequency up to 20 kilohertz (kHz). With Microchip's rugged silicon carbide MOSFET and AgileSwitch families of configurable digital gate drivers, this reference design enables engineers to choose from 700V and 1200V options for currents up to 750A. Microchip also offers module construction options including substrate materials, direct bond copper (DBC) ceramic materials and die attach methods.

     "Given the availability of highly robust SiC MOSFETs and compatible digital gate drivers from a single source, we worked closely with Microchip to design and develop this SiC power supply," said Phillipe Roussel, Ph. Protocol stack reference design. Therefore, with our line of high reliability busbars, capacitors, fuses and cooling systems, we have the ability to optimize any inverter topology for our customers. The versatile Microchip silicon carbide lineup also enables us to Extend these key specifications to higher voltages, currents and switching frequencies to meet each customer's operating point needs."

     In addition to products in Mersen's Power Stack Reference Design, Microchip is a supplier of other SiC power solutions, including a family of MOSFETs and Schottky Barrier Diodes from 650V to 1700V, available in bare die as well as a variety of discrete and multi-die Module packaging.

     Microchip combines in-house silicon carbide chip production with low-inductance power packaging and digital gate drivers, enabling designers to create efficient, compact and reliable end products. Combined with microcontrollers (MCUs), analog and MCU peripherals, and communications, wireless, and security technologies, these devices provide system designers with proven total system solutions for many applications.