Microchip introduces the first aerospace certified dockless power module product line

     To reduce aircraft emissions, developers are increasingly turning to more efficient designs that use electrical systems to replace the current pneumatic and hydraulic systems that power onboard alternators, actuators and auxiliary power units (APUs). In order to realize the next generation aircraft electrical system, a new power conversion technology is needed. Microchip Technology and the Clean Sky Consortium, a consortium of the European Commission (EC) and industry, have jointly developed the first aviation-compliant dockless power module designed to enable more efficient, lightweight, and compact power conversion and motor drive systems.

     Microchip's BL1, BL2, and BL3 series of baseless power modules, developed in partnership with the Clean Sky Alliance, improve AC-DC and DC-AC power conversion and power generation efficiency by integrating silicon carbide power semiconductor technology to support stringent emissions standards set by the European Union and achieve the aviation industry's goal of climate neutrality by 2050. Thanks to an improved substrate, this innovative design is 40% lighter than other similar products and costs 10% less than standard power modules with metal backplates. Microchip's BL1, BL2, and BL3 devices meet all mechanical and environmental compliance requirements specified in RTCA DO-160G Environmental Conditions and Test Procedures for Airborne Equipment, Version G (August 2010). The RTCA is an industry coalition that sets rules on key aviation modernization issues.

     The new series modules come in flat, low-inductance packages with power and signal connectors that designers can solder directly onto the printed circuit board, helping to speed development and increase reliability. In addition, the same height between the modules in the series allows them to be connected in parallel or into three-phase Bridges and other topologies, resulting in higher performance power converters and inverters.

     Leon Gross, vice president of Microchip's Discrete Products business unit, said: "Microchip's powerful new modules will help drive innovation in aircraft electrification and ultimately move toward a lower emissions future. This is a new technology that will enable systems that will usher in a new era of flight."

     This series of modules uses silicon carbide MOSFETs and Schottky barrier diodes (SBD) to maximize system efficiency. The BL1, BL2 and BL3 series are available in packages ranging from 100W to more than 10KW, with many topologies to choose from, including phase pins, full bridge, asymmetrical bridge, boost, buck and dual common source. These high-reliability power modules support voltages ranging from 600V to 1200V for silicon carbide MOSFETs and IGBTs to 1600V for rectifier diodes.

     Microchip's power module technology and its ISO 9000 and AS9100 certified manufacturing facilities leverage flexible manufacturing solutions to deliver high-quality products. While introducing new innovations, Micrchip also works with system manufacturers and integrators on aging management, helping customers minimize redesign efforts and extend life cycles, thereby reducing total system costs.

     Microchip is committed to providing designers with total system solutions for a variety of aerospace and defense applications. Baseless power modules complement Microchip's aerospace portfolio of motor drive controllers, memory integrated circuits, field programmable gate arrays (FPgas), single-chip computers (MCUS), memory protection units (MPUs), timing products, semiconductors, and point-of-load regulators. Microchip also offers a complete line of silicon carbide technology solutions for aerospace, automotive, and industrial applications.